Electronics Forum: delamination and under and component (Page 1 of 5)

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 11:52:24 EDT 2016 | oleksz

Thank you Pavel. Aleksander

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev

Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering

Heat guns and component damage

Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser

We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa

Heat guns and component damage

Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks

OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a

Tinned leads and where the component body is defined

Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501

We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

Spacing and Yield

Electronics Forum | Mon Sep 17 10:11:26 EDT 2001 | jstarkweather

What is the tightest spacing that you have assembled 0201 components? Under what assembly scenarios did you produce the best/worst yield at this spacing?

LGA and Solderballs

Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef

J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause

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