Electronics Forum | Tue Dec 18 10:08:16 EST 2007 | bbarton
Drill a hole through the board (or the BGA) and set a thermocouple into the center of the device (in the X Y and Z dimensions) and run your profiler through the oven until you get the temp you need in the center of the BGA. Attach a second thermocoup
Electronics Forum | Mon Jan 19 08:37:16 EST 2009 | lkpdsund
Hello all! We possess a speedline electrovert omniflo 7 reflow oven at my site. Last week we examined how the solder profile was affected by fan-speed and by providing the soldering process with compressed air(O2) or nitrogen(N2). We also ran the sa
Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax
What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -
Electronics Forum | Wed Jan 27 11:58:35 EST 2010 | randyw
Our products are a mixed technology; with both surface mount components solder side and through-hole top side, in addition to massive heat sink assemblies. We have been using your SN100C solder in our wave solder process with Multicore MFR301 Flux si
Electronics Forum | Wed Jan 27 13:00:35 EST 2010 | randyw
Thank you for your quick responce. First let me say that I have read your articals and found them to be very comprensive and informative. Good Work Patrick My direct expereince with regard to water soluable flux is neglagable at best. In discusion w
Electronics Forum | Fri Jun 04 21:27:16 EDT 2010 | deanm
We have a 4 zone Quad ZCR 531B reflow oven with top side heaters only and a mesh belt. Our boards are 2-6 layer, range in size from 2x2 to 7x15, 0402 to D2PAK. What are the limitations/drawbacks of having top side only heat, especially since about ha
Electronics Forum | Fri May 31 18:56:17 EDT 2013 | hegemon
Thanks to everyone for your answers... > > Delta T > represents the maximum temperature difference > between the hottest and coolest part of the > assembly.........so if we take a profile,the > hottest point would be on the solder pad and the >
Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon
Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p
Electronics Forum | Thu Nov 12 03:58:10 EST 1998 | Earl Moon
| What are the factors that go into determining PCB Board temperature requirements for the Wavesolder process? Most of the recipes I've seen call for preheating the PCB to around 230F - 250F. This temp is about 210F - 230F below the typical solder te
Electronics Forum | Wed Jun 26 00:49:52 EDT 2002 | ianchan
Steve, I'd second Daan's opinion. BGA profile we use gets a peak of 210deg-C to 223deg-C (but that's using our WS paste unique characteristics) with reflow zone holding time of 45-60sec. We had 6 PBGA and 2 ceramic BGA on a 6 layer PCB. typical p
