Electronics Forum: depaneling and sawing (Page 1 of 6)

Component Obsolescence and Availability

Electronics Forum | Thu Mar 31 15:53:23 EDT 2022 | stephendo

And pin outs of both. Once I saw a SOT-6 replaced with a miniSOT-6 (IIRC) The pin outs of the two parts were different. We did make an adaptor board and it wasn't too bad. We populated a panel of the adaptor boards, depanelized them and put them in t

SMT optimization and improvement

Electronics Forum | Wed Feb 21 15:24:29 EST 2007 | wavemasterlarry

I saw that software used by our guys. Takes an Army of guys to run it, not worthit to me.

Component Obsolescence and Availability

Electronics Forum | Thu Apr 07 14:11:33 EDT 2022 | SMTA-69080803

@Stephen How big was the adapter board? It's challenging to depanelize and tedious to manually put these tiny assemblies in a tray.

Gold and Palladium Plating

Electronics Forum | Fri May 17 05:12:51 EDT 2013 | ultimatejoker

What is the disadvantage of palladium plating instead of gold plating? I saw many advantage of palladium plating in term of hardness, wear resistance, and price but why most of the PCB Industries still use gold in PCB pad? Thank you

0201 and uBGA

Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb

On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t

Component Obsolescence and Availability

Electronics Forum | Thu Apr 07 20:42:19 EDT 2022 | stephendo

The boards were just a little larger than a SOT8. IIRC we had a pizza slicer type depanelizer and it wasn't too bad. We just did enough to populate the bare PCBs we had. Where I am now a customer has us put a QFP and a few other parts on a SOW28 f

SPC and Wave

Electronics Forum | Fri Jul 15 08:20:44 EDT 2005 | stepheniii

And why do you want to control the process? To prevent defects, I would think. Actually orginally the way I first saw SPC was to reduce inspection. If you are using SPC for plating thickness, you don't have to measure every piece to be confident the

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

0201 and uBGA

Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick

Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a

Pre- and post-reflow rework

Electronics Forum | Sat Feb 12 13:40:27 EST 2005 | etienne

As I was explaining in my thread, the things that you have to look for when buying an AOI is the false calls rate (which you described perfectly) vis a vis the money and time you want to spend. We bought our machine after that we evaluated some. As y

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