Electronics Forum | Wed Mar 11 17:51:22 EDT 2009 | GSx
Thank you so much Dave, by having different lots of PCB received (same Supllier) with suspected and good carbon ink deposit, I found useful to adopt a comparison test among the different lots by usingthe IPC-TM-650 2.4.1 Adhesion , Tape Testing (lik
Electronics Forum | Thu Feb 26 15:49:48 EST 2009 | GSx
Hi I am looking for informations/specs about graphite/carbon deposited on PWB as a "spring contcat" or land (? not sure how to say in English). - Are there any Standards (IPC?)who define correct thickness of graphite ? - Are there any Test Method
Electronics Forum | Thu Mar 05 22:13:16 EST 2009 | davef
There is no IPC specification on carbon ink. Consider talking to your ink supplier to develop the proper quality definition that you require. Most suppliers have a good understanding of their product performance, for instance: http://www.coates.com/
Electronics Forum | Fri Mar 13 11:55:23 EDT 2009 | boardhouse
Hi GSX, just and FYI on why you are seeing a difference per lots. Carbon Ink is Not used on a steady bases by most manufactures, and shelf life of the Carbon ink is fairly short, my guess is what they are doing is adding thinner to the carbon ink t
Electronics Forum | Mon Mar 05 17:16:11 EST 2001 | lileubie
Hello All, Does anyone have any experience with soldering to vapor deposited metallizations such as gold? Or, does anyone know of any papers discussing soldering to vapor deposited metals? Any info would be greatly appreciated. Thanks, Glenn
Electronics Forum | Mon Jan 06 23:25:29 EST 2003 | Dreamsniper
I made an experiment with our semi-auto stencil printer and used my naked eye to decide whether the alignment and deposition is pass or fail. I based the results in percentage and 100% is perfect result. Now here's the question: Can anyone tell me w
Electronics Forum | Wed Jul 29 10:39:57 EDT 1998 | Ryan Jennens
Howdy all- Does anybody have any experience with solid solder deposits as an alternative to paste deposits? I have heard many good things, but do board fabricators have the technology to do this? Where can I get more information on how to try
Electronics Forum | Tue Jun 27 11:39:16 EDT 2000 | Chris May
Leon, Have you tried a piece of glass, deposit some flux onto glass, place the BGA in the glass to flux it, replace BGA and reflow using existing solder deposition ?? Regards, Chris
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Mon Aug 30 18:35:49 EDT 2004 | msjohnston1
30%). The volume 0201 deposits are around 500 cubic mils. We had a difficult time to get the machine to even measure the small deposits. So with the very poor gauge and the difficulty of running the programs we are looking elsewhere. Mike
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