Electronics Forum | Fri Jan 06 19:57:19 EST 2006 | abhinavajmera
What would be the most suitable expression for ratio of Volume of Alloy to Volume of Paste for a solder paste? For example if we use 63Sn/37Pb alloy with a 90 Wt% metal what would be an appopriate expression for the Volume Ratio?
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Mon Feb 24 15:19:30 EST 2014 | bc
I work with after market cell phones and I need to figure out a robust way to protect the board to board connectors during the vapor deposition process (paralyne). Does anyone have experience with masking and paralyne?
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
Electronics Forum | Mon Mar 05 17:16:11 EST 2001 | lileubie
Hello All, Does anyone have any experience with soldering to vapor deposited metallizations such as gold? Or, does anyone know of any papers discussing soldering to vapor deposited metals? Any info would be greatly appreciated. Thanks, Glenn
Electronics Forum | Mon Jan 06 23:25:29 EST 2003 | Dreamsniper
I made an experiment with our semi-auto stencil printer and used my naked eye to decide whether the alignment and deposition is pass or fail. I based the results in percentage and 100% is perfect result. Now here's the question: Can anyone tell me w
Electronics Forum | Wed Mar 11 17:51:22 EDT 2009 | GSx
Thank you so much Dave, by having different lots of PCB received (same Supllier) with suspected and good carbon ink deposit, I found useful to adopt a comparison test among the different lots by usingthe IPC-TM-650 2.4.1 Adhesion , Tape Testing (lik
Electronics Forum | Wed Jul 29 10:39:57 EDT 1998 | Ryan Jennens
Howdy all- Does anybody have any experience with solid solder deposits as an alternative to paste deposits? I have heard many good things, but do board fabricators have the technology to do this? Where can I get more information on how to try