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editer editer, Author at PCB Assembly,PCB Manufacturing,PCB design - OURPCB

https://www.ourpcb.com/author/editer

– Determine the Right Standards Read More PCB Artwork- Design Guidelines Every PCB Manufacturer Need To Now Gallery PCB Artwork- Design Guidelines Every PCB Manufacturer Need To Now Blog PCB Artwork - Design Guidelines Every PCB Manufacturer Need To Now Do The Complex Measurements Involved In PCB Artwork Designing Befog You? Alternatively, Do You Know You Can Create A PCB That Can Enthrall Your Audience Making Them Burst Out Laughing | Blog | Comments Off on PCB Artwork- Design Guidelines Every PCB Manufacturer Need To Now Read More Multilayer Pool – What You Need To Know About Multilayer PCB Gallery Multilayer Pool editer editer, Author at PCB Assembly,PCB Manufacturing,PCB design - OURPCB Skip to content Call Us Today:+86-311-87874960 | info@ourpcb.com Home About us Payment terms and conditions Custom Wiring Harmess PCB Manufacturing Manufacturing PCB Prototyping PCB Capabilities PCB Equipment PCB Gerbers PCB Assembly PCB Assembly PCBA Equipment PCBA Capabilities Flexible PCB Capabilities Blog Technical Support Quality Assurance Technical Support PCB Design Free Support Solution Delivery Successful Cases 中文

PCB Artwork- Design Guidelines Every PCB Manufacturer Need To Now

https://www.ourpcb.com/pcb-artwork.html

PCB Artwork- Design Guidelines Every PCB Manufacturer Need To Now Skip to content Call Us Today:+86-311-87874960 | info@ourpcb.com Home About us Payment terms and conditions Custom Cable Assembly Custom Wiring Harmess PCB Manufacturing Manufacturing PCB Prototyping PCB Capabilities PCB Equipment PCB Gerbers PCB Assembly PCB Contact Us Home / PCB Artwork- Design Guidelines Every PCB Manufacturer Need To Now PCB Artwork- Design Guidelines Every PCB Manufacturer Need To Now Do The Complex Measurements Involved In PCB Artwork Designing Befog You thickness to the use of Copper-to-Edge Clearance. What Is PCB? PCB Artwork Scanning- Convert Any Artwork Efficiently An Introduction to the Types of PCB Artwork PCB Artwork Design Guidelines PCB Artwork Rules and Recommendations Conclusion 1、What Is PCB . PCB artwork design techniques are a bit complex. It involves rules and guidelines, which a designer must follow to produce a successful artwork. Image 5 : PCB Design Artwork 4、PCB Artwork Design Guidelines The printed board circuits are the backbone of highly technical devices. It supports the manufacturing of nearly every giant technology present today

Design for Test - Test Coach Company

https://www.testcoach.com/service/design-for-test/

. Request a Quote Downloads DFT Guidelines: In-Circuit Test DFT Guidelines: Flying Probe Services In-Circuit Test Flying Probe Test Boundary Scan Test Design for Test About us Company News  Design for Test - Test Coach Company 847.885.4880 News & Events Careers Contact Us 847.885.4880 Test Coach Company In-Circuit Test Flying Probe Test Boundary Scan Test Design for Test Company 847.885.4880 Close Request a Quote Attach files: Test Coach Company 948 Donata Ct., Unit A Lake Zurich, IL 60047 847.885.4880 Service Requested Design for Test Required Documents CAD (in ascii format ) Schematics Gerbers BOM Drawings Design for Test Test Coach offers Design for Test (DFT) consulting to assist customers with design review of prototype boards prior to release for production . Design for Test analysis is extremely important in ensuring that an assembly will achieve the highest possible test coverage. For ICT, this DFT will review the board to confirm that the bed-of-nails test fixture can be fabricated to test an assembly without sacrificing test coverage

http://www.testcoach.com/wp-content/uploads/2016/04/Flying-Probe-DFT.pdf

. Below is a list of guidelines for board design that will optimize flying probe testing. GUIDELINE #FP-1: Test Point Guidelines for use with Flying Probe Testers Test Points should follow the same basic rules as described in our guidelines for ICT bed-of-nails fixtures Flying Probe Guidelines Revision Record Revision Date Approval Originator C 22-Oct-2015 Kevin Schmitt Stephen Whitaker B 1-December-2011 Steve Hoover A 12-June-2006 Jim Arient Steve Hoover A flying . These targets should meet the restrictions outlined in guidelines below. Minimize: Probing of the following items: IC pins, large vias or holes with small pad sizes (see guideline #3 : Handling and Alignment Guidelines The PC board in a flying probe is held on opposite edges by board clamps. These clamps are placed on the longest edges of the board to reduce board flex as the test points make contact

Medical Device Manufacturing Applications

http://www.techconsystems.com/en/applications/industries/medical-device-manufacturing-applications

. An external stroke control adjustment to fine-tune shot sizes. Systems  TS5620 family of Diaphragm valves share the same basic design guidelines for quality, reliable operation and dependable performance while offering a variety of wetted part options that assure . A field replaceable Delrin® seat provides positive shut off and very long life cycles. The compact design allow for easy integration into automated applications.     Typical Fluids

Medical Device Manufacturing Applications

http://www.techconsystems.com/en/applications/industries/medical-device-manufacturing-applications/?sef_rewrite=1

. An external stroke control adjustment to fine-tune shot sizes. Systems  TS5620 family of Diaphragm valves share the same basic design guidelines for quality, reliable operation and dependable performance while offering a variety of wetted part options that assure . A field replaceable Delrin® seat provides positive shut off and very long life cycles. The compact design allow for easy integration into automated applications.     Typical Fluids

NCC Job Posting - Product Development Engineer

https://www.nccas.com/job-posting-product-development-engineer

. Design and development Design testing Design documentation Costing development tools and validation Quality guidelines Required Skills and Experience NCC Job Posting - Product Development Engineer Product Development Engineer   Are you a product development engineer with experience in sanitary conveyor system design and modular plastic belting ?   We are starting a new division and brand in our 33 year old company and looking for top design talent.     This is a chance to be part of something great : Sanitary Conveyors design experience in the food industry Plastic modular or metal belt conveyors Solidworks Perform mathematical calculations for sizing components such as motors, gearboxes , bearings, chain drives, structural materials, etc. 10 years minimum modular or metal belt conveyor design experience Ideal Experience

NCC Job Posting - Machine Operator

https://www.nccas.com/job-posting-machine-operator

. The Machine Operator Sets up and operates a production machine in accordance with established procedures and guidelines. Reads and interprets blueprints and diagrams to select, position and secure machinery . In addition to integrating some of the world’s best automation equipment solutions, we also offer in house mechanical and electrical design and manufacturing

SMT Assembly "Boot Camp" Course | Electronics Assembly Training - Solder.net

https://www.solder.net/training-courses/smt-assembly-class/

design guidelines Printing parameters Squeegee speed and pressure plus other important parameters Under stencil wiping - wet and dry Solder paste inspection Defects typically associated considerations, squeegee selection, etc. Paste deposition will be discussed along with common defects found during the stenciling process and the best resolution Stencil Design Chem-etch, laser cut, e-form Aperture designs IPC-7525 stencil

Solder Mask Repair and Coating Services at BEST Inc

https://www.solder.net/services/mask-repair/

. When there are large mask areas that need repair or the same area in many boards need the same repair or replacement BEST Inc. can design and engineer masks for stencil replacement There are times when there is extensive solder mask damage underneath a BGA due to poor solder mask adhesion, board fabrication problems . BEST can make sure your solder mask is repaired to the industry guidelines, but get it done for you quickly. When required BEST technicians can remove or add legend and other markings from the board surface . Damaged solder mask Repaired Solder Mask SOLDER MASK REPAIR PROCEDURE-GENERAL GUIDELINES 1. Make sure that the area to have the solder mask repaired is cleaned and inspected. 2 . 6. Inspect per the latest IPC-A-610 requirements Testimonials The site looks great. Thank you for your hard work and patience, especially throughout the design phase. Mr Smith : The site looks great. Thank you for your hard work and patience, especially throughout the design phase. Mr Smith: Thank you for your help in getting my business on-line, I am really pleased with my website which presents my companies identity perfectly. Andy Jones

CNC Routed Plastics

http://orionindustries.com/routing.php

. We can also process composite materials such as G-10, FR4 and other materials that are not easily die cut. Most of the same guidelines for our Insulating Materials are applicable to this class of manufacturing (CNC Routed Plastics) as well . Material Specifications - Insulation Products Design Guide Contact Us About CNC Routing Products CNC Routed Plastics -Cutting Capabilities Our material specialists will assist you in determining the most appropriate material for your application. The design considerations will most likely include: Agency approvals, such as UL flame ratings Dielectric strength Final part tolerances Machinability of selected material Minimum internal radii on routed features such as dense rubbers, and thick plastics. Top Home & Stamping Waterjet Cutting Laser Cutting CNC Routed Plastics Formed Plastics Common Applications Custom Design Engineered Prototypes Manufacturing Materials

ROHS Compliance & Wood Packing Compliance

http://orionindustries.com/rohs.php

. It is our intent to be in compliance with: The International Standards of Phytosanitary Measures Publication # 15 (ISPM-15) published guidelines on all wood packaging material, used in international trade & Stamping Waterjet Cutting Laser Cutting CNC Routed Plastics Formed Plastics Common Applications Custom Design Engineered Prototypes Manufacturing Materials

McDry Ultra-Low Humidity Storage Cabinets | Seika Machinery, Inc

http://seikausa.com/mcdry

%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033C and IPC-1601 Guidelines Dehumidifies ICs to prevent micro-cracking Alternative to baking, MBBs and nitrogen storage ESD safe design adheres to IEC-61340-5-1(ESD) Standard McDry dry boxes, dry cabinets and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages  cabinets conform to IPC/JEDEC J-STD 033C and IPC 1601 Guidelines. Product Line DXU-1001 DXU-1002 DXU-1002-L DXU-1002-1000 DXU-501 DXU-580AF DXU-580SF MCU-201 MCU-301 MCU-401 MCU-340 MCU-580 MC-1001 MC-1002 Custom Cabinets McDry Overview Prevent Micro-Cracking

McDry Ultra-Low Humidity Storage Cabinets | Seika Machinery, Inc

http://seikausa.com/McDry

%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033C and IPC-1601 Guidelines Dehumidifies ICs to prevent micro-cracking Alternative to baking, MBBs and nitrogen storage ESD safe design adheres to IEC-61340-5-1(ESD) Standard McDry dry boxes, dry cabinets and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages  cabinets conform to IPC/JEDEC J-STD 033C and IPC 1601 Guidelines. Product Line DXU-1001 DXU-1002 DXU-1002-L DXU-1002-1000 DXU-501 DXU-580AF DXU-580SF MCU-201 MCU-301 MCU-401 MCU-340 MCU-580 MC-1001 MC-1002 Custom Cabinets McDry Overview Prevent Micro-Cracking

Professional Development Courses | SMTA International

https://www.smta.org/smtai/courses.cfm

. This course will cover the practical details of BTC design and assembly processes. This course is based on Surface Mount Technology: Principles by Ray Prasad and Practice and IPC 7093 Design and Assembly Process Guidelines for BTCs also co-chaired Ray . SUNDAY, September 22, 2019 PDC01     Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits Vern Solberg, Solberg Technical Consulting Sunday, September 22 | 8:30am — 12 :00pm This course has been developed to furnish the design professionals, systems engineers and assembly and test engineering specialists with a comprehensive understanding of the materials , fabrication process variations and preferred design practices for developing flexible and rigid-flex circuits. Topics studied will include both flexible and glass reinforced rigid base material variations as well as alternative flexible and rigid-flex circuit fabrication methodologies ! Ray Prasad, Ray Prasad Consultancy Group Sunday, September 22 | 8:30am — 12:00pm This course is based on IPC 7530 Guidelines for Temperature Profiling for Mass Soldering Processes chaired by Ray Prasad

Additive Electronics Conference

https://www.smta.org/additive/call_for_abstracts.cfm

by: In cooperation with: Call for Abstracts You are invited to share your research at the conference on any of the topics below: Additive PCB Technologies Advanced HDI Technology - Subtractive Etch Processing Assembly Chemistry Design Software Flexible Hybrid Electronics (FHE ) Abstract Submission Deadline: July 1, 2020 Submit Your Abstract Here! Submission Guidelines for Abstracts Abstracts are solicited to describe original, unpublished, and non-commercial work

collaboratively design and build a formula-style electric or plug-in hybrid racecar- Sponsor - PCBWa

https://www.pcbway.com/project/sponsor/collaboratively_design_and_build_a_formula-style_electric_or_plug-in_hybrid_racecar.html

collaboratively design and build a formula-style electric or plug-in hybrid racecar- Sponsor - PCBWay PCBWay PCB Instant Quote PCB Assembly Capabilities Login ****ard AUSTRALIA 13 0 P**Way UNITED STATES OF AMERICA 16 6 4 Like collaboratively design and build a formula-style electric or plug-in hybrid racecar “The Formula Hybrid Competition is an interdisciplinary design and engineering challenge for undergraduate and graduate university students . They must collaboratively design and build a formula-style electric or plug-in hybrid racecar and compete in a series of events. This educational competition emphasizes drivetrain innovation and fuel efficiency in a high-performance application teams.The majority of the parts and systems on our vehicles are 100 % custom to meet our very specific needs. Project Introduction: This project provides the necessary control and fault indication for our energy storage system to operate within the guidelines of the 2016 Formula Hybrid competition

How to Design for Manufacturability - Blackfox

https://www.blackfox.com/news-events/how-to-design-for-manufacturability/

How to Design for Manufacturability - Blackfox Phone: (888) 837-9959 | [email protected] Store | Home | EN ES Course Calendar Course Calendar 2019 IPC Certification IPC Instructor IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT Recertification IPC 7711/7721 CIT IPC 7711 & Events Testimonials References Business Partners Career Opportunities Career Opportunities Contact How to Design for Manufacturability Home / News & Events / How to Design for Manufacturability ­ Previous Next How to Design for Manufacturability Manufacturing is a big part of the U.S. economy. Did you know we would be the ninth-largest economy in the world if we were looking at manufacturing alone ? But more than simply manufacturing, it’s important to create a high-quality, usable product, and to do so, you must create a seamless integration between your product design and your planning process , it’s helpful to hire engineering and consulting services to create structured guidelines for assembly, manufacturing, and testing so you can reduce the difficulty and cost of production as you move forward

Workforce Development Service - Blackfox.com

https://www.blackfox.com/blackfox-services/specialized-services/workforce-development/

& Knowledge Assessment Based upon the Training Matrix requirements Assess Employee’s skills and knowledge Certify those successfully meeting the requirements Design Training Plan to address knowledge and skills “gaps ” Implementation Development of Client Specific Instructional Materials Review Lesson Plans with Instructor Establish Program Guidelines in alignment with ISO 9000

KYZEN’s Joe McChesney to Present on Environmental Concerns of Parts Cleaning in the Industry | Kyzen

https://www.kyzen.com/main-pages/kyzens-joe-mcchesney-present-environmental-concerns-parts-cleaning-industry/

. As existing solvents are regulated and new solvents emerge, it is important for the user public to understand the benefits and guidelines for using these governmental approved solvents in conjunction . Joe will present on all these aspects, and will be available for questions afterwards. McChesney has more than 39 years of experience with solvent and aqueous cleaning processes from conceptual design through field operation

KYZEN Technical Service and Support

https://www.kyzen.com/technical-care/technical-support/

” brings the cleaning chemistry, equipment, and water treatment all together in one simple integrated solution for you. This means optimizing process performance and maximizing tank life using three simple guidelines ²) manufacturing site in the USA, we design and fabricate custom solutions for you, wherever you are. For example: Process control and automation Chemical conservation equipment and emission reduction Rinse water recycling and waste concentration Machine retrofits and conversions, such as water to chemistry

Terms of Use

https://www.clariant.com/en/Meta-Nav/Terms-of-Use

. Trademark and brands information is available on the Clariant Web site. Clariant generally does not object to your placing a link on your Web site for easy connection to a Clariant Web page, provided that the guidelines ://www.clariant.com from your website. To display the link logo, follow these two easy steps: Read the guidelines for use of the link logo; and Download the link logo onto your website by right-clicking the image above and selecting Copy or Save Picture As to save the image to a selected location . Guidelines for use of the clariant.com link logo on non-Clariant web sites: Except as Clariant may explicitly authorize elsewhere, non-Clariant websites may display only the logo provided above ("Logo "). By downloading the Logo, you agree to be bound by these Guidelines. You may only display the Logo on your website and not in any other manner with, sponsorship, endorsement or license by Clariant. The Logo must appear by itself with a minimum spacing (the height of the Logo) between each side of the Logo and other graphic or textual elements on your page. The Logo may not be used as a feature or design

Quality by Design

https://www.clariant.com/en/Business-Units/Masterbatches/Healthcare-Medical-and-Pharmaceutical/Mevopur-and-Remafin/Quality-by-Design

Quality by Design By using this website you consent to the use of cookies. Detailed information about the use of cookies on our website is available here & Pharmaceutical / Healthcare Polymer Solutions / Quality by Design Mevopur and Remafin Quality by Design CONTROLLED, CONSISTENT, COMPLIANT To help reduce the risk of non-compliance to demanding regulations for medical devices and pharmaceutical packaging, we need to start at the beginning of the process: the materials used and what’s inside. Materials and their impact on patient safety Increased use of Quality by Design . During 2010 each of the 3 medical Centers of Competence gained external certification to ISO13485. Our ‘open to audit’ policy and controlled operations help meet FDA and other regulatory guidelines regarding fully traceable production . Documented design review and consultation process before we start development to ensure we fully understand your needs for the application and regulatory requirements

Sponsors | IPC APEX EXPO 2019

http://www.ipcapexexpo.org/Html/sponsors.htm

Sponsors | IPC APEX EXPO 2019 Become an Exhibitor Why Exhibit? What's Included? Application/Contract for Exhibition General Rules and Regulations Booth Space Selection Guidelines Turnkey Booth Packages 2019 Exhibitor List 2019 Floor Plan Already an Exhibitor 2019 Exhibitor List & Packaging Medical Product Outsourcing (MPO) Magazine Mexico EMS PCB007 PCB Design007 Power Electronics World Printed Circuit Design & Fab Magazine Scoop Communications Silicon Semiconductor Magazine SMT007 SMT Today Magazine SMTnet.com U.S

IPC APEX EXPO 2019 Innovation Awards | IPC APEX EXPO 2019

http://www.ipcapexexpo.org/Html/exhibit/already/innovation-awards.htm

IPC APEX EXPO 2019 Innovation Awards | IPC APEX EXPO 2019 Become an Exhibitor Why Exhibit? What's Included? Application/Contract for Exhibition General Rules and Regulations Booth Space Selection Guidelines Turnkey Booth Packages 2019 Exhibitor List 2019 Floor Plan Already an Exhibitor 2019 Exhibitor List : Assembly Assembly Materials Environmental Industry 4.0 PCB Design PCB Fabrication PCB Materials Test & Inspection Services Software Other (please list

PCBL - Library Expert [USER GUIDE]

http://www.pcblibraries.com/Products/FPX/UserGuide/default.asp?ch=216

& Webinars PCB Library Expert - USER GUIDE PCB Library Expert to Proteus Design Suite Proteus uses the PADS ASCII Library format to import footprints from PCB Library Expert         - BOM Builder Service Getting Started         - Overview         - Intro to FPX Files         - FPX Guidelines         - User Preferences

PCBL - Library Expert [USER GUIDE]

http://www.pcblibraries.com/Products/FPX/UserGuide/default.asp?ch=404

as the Attribute Name, then enter the filename for the Attribute Value. Design Properties If you want an invisible attribute then when editing the footprint select Edit and Design Properties from the menu bar         - Install LE POD Builder         - BOM Builder Service Getting Started         - Overview         - Intro to FPX Files         - FPX Guidelines         - User Preferences

4.0.1.6a download gas

http://www.hellerindustries.com/search.php?zoom_query=4.0.1.6a+download+gas&zoom_page=1&zoom_per_page=10&zoom_and=0&zoom_sort=0

... importantly, this development extended preventative maintenance intervals from weeks to months for our systems. Additional breakthroughs in energy management have helped Heller's customers remain environmentally responsible while still maintaining their sustainability guidelines . Additional breakthroughs in energy management have helped Heller's customers remain environmentally responsible while still maintaining their sustainability guidelines . 2 INTRODUCTION/BACKGROUND 2 DESCRIPTION& PROCEDURE. 2 DESIGN& OPERATIONAL PROPERTIES 3 CHILLER PLATE. 4 GAS MODELING TEST. 5 GEN 9 6 GEN 9 SECTION VIEW. 7 PROFILE RESULTS& CONCLUSION

4.0.1.6a download gas

http://www.hellerindustries.com/search.php?zoom_query=4.0.1.6a+download+gas&zoom_per_page=10&zoom_and=0&zoom_sort=0

... importantly, this development extended preventative maintenance intervals from weeks to months for our systems. Additional breakthroughs in energy management have helped Heller's customers remain environmentally responsible while still maintaining their sustainability guidelines . Additional breakthroughs in energy management have helped Heller's customers remain environmentally responsible while still maintaining their sustainability guidelines . 2 INTRODUCTION/BACKGROUND 2 DESCRIPTION& PROCEDURE. 2 DESIGN& OPERATIONAL PROPERTIES 3 CHILLER PLATE. 4 GAS MODELING TEST. 5 GEN 9 6 GEN 9 SECTION VIEW. 7 PROFILE RESULTS& CONCLUSION

Flyer_Leitfaden_engl_web (002).pdf

http://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/4-Academy/agenden/2018/GfKorr-Leitfaden-Flyer.pdf

and their possible applications for the functionality of electronic assemblies is achieved. Target Groups Production engineering, quality assurance, process technology, analytics, design and construction as well as all users *) Members of GfKORR € 795,-- Non-Members € 835,-- Students (under 35 years) € 150,-- *) no VAT requested according to § 4.22 UStG, registration fee may include Business Package with VAT The registration fees include the guidelines for the Utilisation and Fabrication of Protective Paints for Electronic Assem- blies, list

Leitfadentraining_engl.2019_web.pdf

https://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/4-Academy/agenden/2019/GfKorr_Application-Protective-Coatings-Flyer.pdf

and their possible applications for the functionality of electronic assemblies is achieved. Target Groups Production engineering, quality assurance, process technology, analytics, design and construction as well as all users The GfKORR GfKORR - Society for Corrosion Protection *) Members of GfKORR € 795,-- Non-Members € 815,-- Students (under 35 years) € 150,-- *) no VAT requested according to § 4.22 UStG, registration fee may include Business Package with VAT The registration fees include the guidelines for the Utilisation and Fabrication of Protective Coatings for Electronic As- semblies

00600-228

http://www.hellerindustries.com.cn/00600-228.pdf

(and may continue to be) used for lead-free reflow development, the lat- est advances in oven design can enhance lead-free assembly implementation . The newest design concept in center board support involves using the mecha- nism only in those areas of the oven where it is required — reflow and cooling. Typi- cally, the supports that run the length of an oven require large, bulky rails that can block air flow to the PCB and increase . Heated length 105" [267 cm] 9-zone Air Convection Configuration (L-R) 150" [381 cm] (2) Cool zone(2) Center draw exhaust Figure 3. This reflow oven design for lead-free processing features nine zones . Some systems have provisions for the addi- tion of a Hepa filter to comply with local EPA or ISO guidelines, minimizing the amount of particulates released

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

http://www.hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5 ]. Because a finished electronic assembly can be rejected based on the IPC guidelines for macro or process voiding defects [4, 5], it is desirable to eliminate voiding, or least reduce the void density substantially , February 2005. [5] IPC-7095B, “Design and Assembly Process Implementation for BGAs,” Section 7.5.1, 76-83., IPC, October 2004. [6] Gregory Henshall, Keith Sweatman, Keith Howell, Joe Smetana and Richard Coyle, Richard Parker, Stephen Tisdale, Fay Hua ] Werner Engelmaier, “Surface Mount Solder Joint Long- Term Reliability: Design, Testing, Prediction,” Soldering and Surface Mount Technology, vol. 1, no. 1, 14-22, February, 1989. [9] Richard J. Coyle, Diane E. Hodges Popps, Andrew Mawer, Donald P. Cullen Characterization, and Test Protocols for Accelerated Temperature Cycling,” Proceedings of SMTAI 2012, 335- 347, Orlando, FL, October 2012. [20] Werner Engelmaier, “Surface Mount Solder Joint Long- Term Reliability: Design, Testing, Prediction,” Soldering and Surface

Document Revision Table | IPC

http://ipc.org/4.0_Knowledge/4.1_Standards/revstat1.htm

– and Double-Sided Flexible Printed Wiring  D-12 Superseded by IPC-6013 Rev A 9/86 Orig. 1/74   IPC-FA-251 Guidelines for Single and Double Sided Flex Circuits  D-12 Orig. 2/92   IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board ; Supersedes IPC-SC-320B and IPC-ML-950C   IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies  6-10b Orig. 7/96   IPC-D-300 Printed Board Dimensions and Tolerances  1-10a Superseded by IPC-2615 Rev G 1/84 Rev F 11/74 Rev E and Use    Orig. 3/96   IPC-D-316 Design Guide for Microwave Circuit Boards Utilizing Soft Substrates  D-21b Superseded by IPC-2252 Orig. 5/95   IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques  D-21a Superseded by IPC Substrates for Additive Process Printed Boards    Superseded by IPC-4101 Orig. 1/82   IPC-MB-380 Guidelines for Molded Interconnection Devices    Orig. 10/90   IPC-D-390 Automated Design Guidelines    Rev A 2/88 Orig. 7/74   IPC-C-406 Design and Application Guidelines for Surface Mount Connectors    Orig. 1/90   IPC-CI-408 Solderless Surface Mount Connector Design Characteristics and Application Guidelines B-22c Orig. 1/94   IPC-BP-421 General Specification for Rigid Printed Board Backplanes with Press Fit

Status of Standardization | IPC

http://ipc.org/Status.aspx

Pattern Standard IPC-7526A Stencil and Misprinted Board Cleaning Handbook IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines IPC-9111 Materials Quality/Test Design Printed Electronics Lead Free Market Research Management Roadmap Artwork/Test Vehicles/Solder Kits Presentation @ipc.org. Status of Standardization Published Standards IPC-6903 October 2015 Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry ) IPC-9121 Troubleshooting for Printed Board Fabrication Processes Proposed Standard for Ballot IPC-D-620 Design and Critical Process Requirements for Cable and Wiring Harnesses J-STD-609B Marking Boards IPC-A-610EC IPC-A-610 Telecom Addendum IPC-HDBK-620 Cable and Wire Harness Design Guideline IPC-A-640 Requirements and Acceptance for Optical Fiber Terminations, Cable/Harness Assemblies and Installation IPC-CC-830C Qualification and Performance

Chapter Tutorial Program (CTP)

http://smta.org/education/chapter_tutorials/chapter_tutorials.cfm

. The purpose is to address the latest information or most recent issues on a specific technology. Want to instruct an SMTA tutorial? View the tutorial guidelines in manufacturing, quality and design. Course Outline: Part 1 Introduction - Prevention: Process Development and Validation - Variation (Common Cause) - Continuous Improvement Defect Definition - Failure with OEM’s, Contract Assemblers, and Equipment Manufacturers to solve design and assembly problems, optimize facility operations, as well as teaching basic and new technologies in private and public forums for all levels of personnel Design for Manufacturability (DFM) specification development Equipment evaluation and selection SMT process equipment benchmark testing and evaluation SMT product development Jim is one of the authors of the highly acclaimed SMTA in manufacturing, quality and design. Course Outline: Part 1 Introduction - Prevention: Process Development and Validation - Variation (Common Cause) - Continuous Improvement Defect Definition - Failure

Upcoming Expos

http://smta.org/expos/

.” Special Thanks to Our Lunch Sponsor: PM Technical Sessions 1:00PM – 2:00PM Industry Roundtable Moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB/CIRCUITS ASSEMBLY; President of UP Media Group Hosted and moderated by Pete Waddell, Technical Editor, PRINTED CIRCUIT DESIGN & FAB and a PCB designer for 20 years, this informal discussion will focus on the world of PCB design, its challenges, its future, with a focus on how to facilitate communication with the entire PCB supply chain, including fabrication and assembly. If you're a PCB designer or engineer, provide EDA software or just want to understand how to better work with a design group, join us for a casual conversation that promises to be a lively look at the world of PCB design...and beyond. Solder Paste and Voiding Challenges Tim O’Neill, Technical Marketing Manager, AIM Solder Tim O’Neill will present the salient details of two separate presentations

Side-Mount Loader and Unloader User Guide

http://www.gpd-global.com/co_website/pdf/doc/Side-Mount-Loader-Unloader-Guide-24000600.pdf

influences, remaining hazards during operation cannot be totally eliminated. For user and operator safety, as well as to avoid material damage, all safety guidelines in this manual must be observed . Customer-applicable local guidelines for accident prevention must be added to this user manual. CAUTION Notices Despite adhering to all applicable safety guidelines, some hazards remain which should be taken note of for operation of the system: CAUTION . 11/13/17 Side-Mount Loader & Unloader User Guide iv GPD Global© WARNING Notices Despite adhering to all applicable safety guidelines, some hazards remain which should be taken note of for operation of the system to the guidelines within this manual. Theory of Operation 1. Magazines filled with substrates are manually placed on the Loader tray(s). Empty maga- zines are manually placed on the Unloader tray(s). 2. The lift systemmoves a Loader magazine to the programmed stops and warns the operator. Features • Side-mount design • Eject Pusher for product-to-conveyor (Loader) • Inject Pusher for conveyor-to-magazine (Unloader) • Touch screen interface • SMEMA communications • Operates individually, as part

Side-Mount Loader and Unloader User Guide

https://www.gpd-global.com/co_website/pdf/doc/Side-Mount-Loader-Unloader-Guide-24000600.pdf

influences, remaining hazards during operation cannot be totally eliminated. For user and operator safety, as well as to avoid material damage, all safety guidelines in this manual must be observed . Customer-applicable local guidelines for accident prevention must be added to this user manual. CAUTION Notices Despite adhering to all applicable safety guidelines, some hazards remain which should be taken note of for operation of the system: CAUTION . 11/13/17 Side-Mount Loader & Unloader User Guide iv GPD Global© WARNING Notices Despite adhering to all applicable safety guidelines, some hazards remain which should be taken note of for operation of the system to the guidelines within this manual. Theory of Operation 1. Magazines filled with substrates are manually placed on the Loader tray(s). Empty maga- zines are manually placed on the Unloader tray(s). 2. The lift systemmoves a Loader magazine to the programmed stops and warns the operator. Features • Side-mount design • Eject Pusher for product-to-conveyor (Loader) • Inject Pusher for conveyor-to-magazine (Unloader) • Touch screen interface • SMEMA communications • Operates individually, as part

http://www.soldertools.net/content/Repair%20Manual%2006%202018%20Rev%205.0.pdf

handling guidelines for electronic components and assemblies are applicable to any rework or repair done to PCBs. These guidelines are referred to in the following provided (if required).  Apply epoxy within 50 minutes after mixing. • Cure the epoxy as per the manufacturers' guidelines. It should dry somewhat concave (protruding from the surface of the circuit board) BEST Inc. PCB Repair Manual Rev 3.0 05/2018 Page 18 color • Apply epoxy with a small brush or dental pick within 50 minutes after mixing. • Cure the epoxy as per the manufacturers' guidelines. It will dry somewhat concave (protruding from the surface of the circuit board). NOTE: Protect heat sensitive .  Apply adhesive within 50 minutes after mixing. • Backfill the mixed epoxy into the corner of the box until the level of the epoxy is even with the level of the PCB laminate surface. • Cure the epoxy as per the manufacturers' guidelines. It will dry

BGA Thermal Shock Testing

http://www.soldertools.net/product_images/stencilquik/papers/SelectSolderPasteDeposit.pdf

guidelines of PBGAs calls for a 8 mil thick rework stencil due to the increased paste print volumes’ effect on expected reliability gains. Motorola’s part application guideline also warns against the dangers of using too thin of a rework stencil “as lower application guidelines, the negative aspects of standard paste screening on the board for rework are “(that)…there is limited room for local screening (and) poor print releases when lifting the local site stencil” (2). These negatives in the solder paste , January 1999. [ 8 ] “Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays”, Thomas Cipelewski and M Meilunas, IPC APEX SMEMA Council Designers Summit 04 [ 9 ] IPC 7095-Design and Assembly Process Implementation for BGAs

Microsoft Word - Terms and Conditions of Purchase2.docx

https://www.okinternational.com/File%20Library/Terms%20And%20Condition/OK-US---Purchase-TC.pdf

 or advance payments will be  made, nor will any drafts be honored.    5. WARRANTY.    Seller  warrants  all  articles  and materials  delivered  hereunder  to  be  free  from  all  defects,  including  defects  in  labor, materials  design  and  fabrication   hereunder which  has  therefore  been  finally  accepted  by  Buyer.   Notwithstanding the foregoing if the articles or materials to be furnished hereunder consist of items specially manufactured to Buyer’s design or specifications,  Buyer, in its discretion  infringement of any U.S. patent, trademark or similar right by, or (ii) actual or alleged defects in  material, workmanship or design of, materials or articles  furnished by Seller hereunder.   Seller shall settle or defend at  its expense all such claims  Act and the Water Act, respectively, and all regulations and  guidelines issued there under before the award of this Purchase Order.  (2) That no portion of the work required by this Purchase Order will be performed in a factory listed

Microsoft Word - Terms and Conditions of Purchase2.docx

http://www.okinternational.com/File%20Library/Terms%20And%20Condition/OK-US---Purchase-TC.pdf

 or advance payments will be  made, nor will any drafts be honored.    5. WARRANTY.    Seller  warrants  all  articles  and materials  delivered  hereunder  to  be  free  from  all  defects,  including  defects  in  labor, materials  design  and  fabrication   hereunder which  has  therefore  been  finally  accepted  by  Buyer.   Notwithstanding the foregoing if the articles or materials to be furnished hereunder consist of items specially manufactured to Buyer’s design or specifications,  Buyer, in its discretion  infringement of any U.S. patent, trademark or similar right by, or (ii) actual or alleged defects in  material, workmanship or design of, materials or articles  furnished by Seller hereunder.   Seller shall settle or defend at  its expense all such claims  Act and the Water Act, respectively, and all regulations and  guidelines issued there under before the award of this Purchase Order.  (2) That no portion of the work required by this Purchase Order will be performed in a factory listed

Smart Sonic SE-1 Evaporator

http://ce-exchange.com/detail/smart-sonic-se-1-evaporator-6128.cfm

” to drain and offer environmental peace of mind.   • Traditional style evaporator with a heavy duty design • 12 KW bottom-mounted electric contact heaters .   Stainless Steel Construction - Eliminates rust and corrosion common to other evaporators   Meets MP&M Guidelines because nothing is discharged to drain

Diversitech Mini Down Draft table

http://ce-exchange.com/detail/diversitech-mini-dd-downdraft-table-6188.cfm

: • Simple to use, plug & play design • Ultra-small footprint & no permanent ducting • Complies with OSHA guidelines for safe capture of dust, smoke, and weld fumes Features: • Flexible 42” x 30” worksurface

https://qualitek.com/wp-content/uploads/2019/05/CFSI_CMRT_5.12.xlsx

are consistent with the guidelines included in the internationally recognized OECD Guidance. This question is mandatory. F. This is a question to disclose whether a company requests their supplier to fill out a conflict minerals declaration. Acceptable answers based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,400 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test

FG_1.book

http://islandsmt.com/wp-content/uploads/2017/02/18Fixt.pdf

....................................................................... 1-14 Design Aids ............................................................................................................. 1-15 Fixture Design Guidelines your local Teradyne sales representative. Fixture Design Guidelines Fixture building is a precise procedure which requires drilling, probe locating, node mapping, node wiring, and power distribution. Consider the following factors before you build testers are capable of delivering up to 45 amps. To select an adequate number of power probes, follow guidelines in the Fixture Wiring section of this manual. 1-16 Z1800-Series Fixturing Guidebook Fixture Design and Assembly Density Avoid placing large .......................................................................................................... 1-3 Board Design Considerations ................................................................................... 1-3 Ease of Manufacture ................................................................................................... 1-10 Available Options ............................................................................................. 1-11 Fixture Design and Assembly

03066i114siteprep.book

http://islandsmt.com/wp-content/uploads/2017/04/HP3070-Site-Preparation.pdf

) by a UK-appointed Competent Body, namely, Design to Distribution Limited Westfields House, West Avenue Kidsgrove, Stoke-on-Trent Staffordshire, ST7 1TL United Kingdom Certificate Number of this product. Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design, manufacture, and intended use of this product. Agilent assumes no liability for the customer’s failure to comply ................................................................................................... 7-4 Connecting Vacuum to the Testhead ..................................................................................... 7-5 Vacuum Guidelines

Select Cure IR Oven

http://www.nordson.com/en-us/divisions/asymtek/documents/Manuals/303779b.pdf

an adequate exhaust system. Nordson Corporation does not accept engineering responsibility for exhaust system design and installation. If you do not have experience designing and installing exhaust systems, seek professional assistance. See Figure A 3-1 column Duct Design Recommendations Diameter: 20 cm (8 in.) Length: 15 m (50 ft) maximum Number of 90 elbows 4 maximum Pneumatic Requirements Exhaust Requirements Installation Requirements A 3-3 1998 Nordson Corporation All rights reserved 303 779B Issued -driven. The oven utilizes industrial controllers with Eurocard architecture and a high speed buss structure. Every board in the oven is an intelligent board with its own microprocessor, and communicates with all the other boards on the buss. This design

CONFORMAL

http://www.nordson.com/en-us/divisions/asymtek/documents/manuals/7211567_A.pdf

must be secured to prevent movement that could cause injury to personnel and damage to the equipment and facility. Personnel To prevent injury during an earthquake, all personnel should follow facility earthquake safety guidelines. Movement The TC V3 by a trained service technician only to prevent damage to the equipment. Failure to do so could render the factory warranty null and void. Before starting up the Cure Module check the following: • Electrical network is compatible with the cure module design

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