Electronics Forum | Thu Nov 08 08:44:22 EST 2007 | aj
Hi, I have just taken a look at the Connector Images. Is there a difference in pitch between both connectors ? From the photo it looks like the Annular Rings are oversized on Image #1 especially around the centre area ( this might be the image ).
Electronics Forum | Wed Nov 14 13:05:40 EST 2007 | rgduval
I had one project with micro-vias in 0805 and larger pads, with no issues. But my most recent project had vias that were larger than the 0402 pads that the via was in. To the point that for a number of the lands, there was no visible pads (a couple
Electronics Forum | Thu Jan 03 08:02:48 EST 2008 | dstevenson
hi all and a happy new year, does anyone know if there are any industry best practices for board design in terms of selective soldering?? Whilst right now the product portfolio of my company is not suitable for the introduction of a selective solderi
Electronics Forum | Thu Jan 31 07:55:04 EST 2008 | tonyamenson
I noticed on the floor that workers hand place some SMT parts becuase some parts that came in a tube (instead of on a reel) do not fit properly into the tube feeders. The tubes dont align properly in the feeders becuase of their size. Are there any
Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
Electronics Forum | Thu May 01 08:35:11 EDT 2008 | cyber_wolf
We are having issues with these parts tilting to one side during reflow. Of course when they are tilted, they have to be reworked because the shield won't fit on. Changing board design and part design is not an option.... I think there are 2 reasons
Electronics Forum | Fri May 09 20:17:58 EDT 2008 | fastek
Seems that if you are worried about the paste staying in the machine for too long then you are not the type of user "auto paste" was designed for..........and you will see zero benefits from it. This feature was designed to try to squeeze another f
Electronics Forum | Sun Jun 01 00:58:09 EDT 2008 | robi
Just for INFO Folungwin Printer Win 6 simular to Ekra but with major design improvments, also in the next year a new printer to be released The Smart 3 which is simular to a Dek but with 39 design changes of improvement, both printers are same as be
Electronics Forum | Fri Jul 11 09:37:16 EDT 2008 | realchunks
BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a must. Especially oven profiles as this is your only indication that the inner balls have reached proper temp, since you cannot visually tell. If you g
Electronics Forum | Wed Feb 04 08:49:52 EST 2009 | milroy
Hi First of all you have to respect the dwell time and the time after the reflow at peak tmeperature.(225�C for Pb and 235�C for Pbf) You can find the reflow profile from manufacturer for majority of parts designed for reflow sodlering. In general t
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