Electronics Forum | Sun Apr 28 05:36:54 EDT 2002 | Johan Bergstrom
I don�t believe I am reading this! Stefan, as a colleague feeder designer I have all respects for your knowledge, but you theorize without having tested this. The design team and I have been working with this technology for several years now. Sure,
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Fri Jun 21 10:22:13 EDT 2002 | russ
A lot of your success with waving SMT components is dependent upon design and what type of wave forms you use. Without knowing how the board is laid out or what type of wave you have it is pretty difficult to determine what the yield differences wil
Electronics Forum | Wed Jun 26 09:10:21 EDT 2002 | davef
I want to suggest: * IPC-2221, Generic Standard On Printed Board Design * IPC-222X, Sectional Design Standard For Printed Board For Y Printed Boards ... but I just thumbed through both quickly and saw nothing, I really didn't spend as much time as I
Electronics Forum | Thu Jul 04 00:18:10 EDT 2002 | ianchan
Hi mate, in humble opinion, Hot air Convection types are here to stay. Some machine designer folks are combining IR and Hot Air Relow into integrated technological units for commercial sale to folks like us. Dave F tells us that another group of d
Electronics Forum | Tue Sep 17 15:59:48 EDT 2002 | Randy V
No-Clean fluxes are difficult to clean off boards. Cleaning effectivness depends on the washer, the chemistry, the flux type, number of reflows, and the time between reflow and washing. White residue is flux residues that have started to break down b
Electronics Forum | Sat Sep 14 01:34:19 EDT 2002 | Yngwie
I have the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcoming designs? 2) What are the manufacturi
Electronics Forum | Tue Sep 17 00:40:39 EDT 2002 | yngwie
Hi all Experts, Desperately need your help on the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcom
Electronics Forum | Wed Sep 25 05:08:33 EDT 2002 | msimkin
Gregg, We had a similar problem with our 0603 leds. They were being placed bang on, however, during the reflow, they twisted, fell sideways etc. We played with our profile, played with the paste volume & land pattern design, and only had a small impr
Electronics Forum | Fri Sep 27 08:12:19 EDT 2002 | yngwie
Dear all, My customer is asking me to add chevron solder mask registration marks to their board design, drive fabrication capability study from their board vendor(s), and make sure tolerances are established correctly for copper traces and solder mas
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