Electronics Forum | Thu Nov 09 01:17:28 EST 2000 | DL
John, Ahhhh the possibilities. Have you considered the dissipative properties of available substrates? A ceramic (excellent heat dissipation) based substrate could be a possibility for future designs. Maybe there are surface mount parts out there fo
Electronics Forum | Mon Nov 06 21:09:47 EST 2000 | Dave F
That's cool that you used the Archive. Consider running a designed experiment on your board, using your flux and solder, the limits from the Archive, and on your machine to dial in the spread in dwell numbers you see in the SMTnet Archives to your s
Electronics Forum | Mon Nov 06 11:34:54 EST 2000 | Wolfgang Busko
Hi John, can�t find that one in the archives. Isn�t all the trouble you may get dependend on the way you design the thing? For example, tight fit with with step/ridge nearly zero and clamps for holding down the inner circle to prevent vibrations. F
Electronics Forum | Wed Nov 01 14:42:17 EST 2000 | MRMAINT
We had some similar issues on one of our products.The oven profile is critical. We found that with a gradual soak ramp up it took care of about 80% of the tombstoning.The other thing that we found was pad design issues. Take a look at the sept. issu
Electronics Forum | Thu Nov 02 22:19:32 EST 2000 | Dason C
For 0402 or less, it is prefer to start on the pad design but it doesn't help right now. Senju Metal say that they have develop one of the paste can reduce the tombstoning problem but I don't have chance to test it. Please try and post your finding
Electronics Forum | Tue Oct 31 10:47:56 EST 2000 | FWN
Agreed. However, this is for a research paper that my boss may turn into a presentation designed to be given to accountant types. As such, I'm looking for an average hypothetical example. I know that conditions may vary with circumstances, but I'v
Electronics Forum | Sat Oct 28 02:11:56 EDT 2000 | hendri
dear sir/madame I am student sepuluh nopember institute technology of surabaya in indonesia country i have project that use cad/cam software for making pcb and i've got information that orcad,protel(os windows) and menthor graphic () can use
Electronics Forum | Sat Oct 28 08:41:37 EDT 2000 | Aaron
1. Check printing accuracy. 2. Check placement accuracy. 3. Your components should be kept in a good environment to prevent oxidation of terminations. 4. Pads pattern should be designed according to standards. If 1.2. are okay, you should suspect 3
Electronics Forum | Sat Oct 28 10:13:27 EDT 2000 | KF Lok
1) Try to keep lead as short as possible. 2) The long side of the connector in the direction of conveyor. 3) Use pallet, design such that the connector is 45 degree to the wave.( or conveyor). May not remove all shorts but reduce to one area i.e. th
Electronics Forum | Wed Oct 11 09:23:06 EDT 2000 | Roger Squires
Has anyone had any success in finding open circuits (i.e. ball present but not soldered to PCB) under collapsible BGA's using an Agilent HP5DX x-ray tester and the BGA2 algorithm? Can anyone recommend an elongated pad design which produces the neces
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