Electronics Forum | Wed May 02 11:00:46 EDT 2007 | bartlozie
to get a 0-defect layout, OEM and CM have to work together, If you know what connections (balls) are the problem ones, let me know, and send me the gerber-layers + solderpaste layer, so we can see if the problem is design related or if you CM realy
Electronics Forum | Tue Jan 23 07:18:24 EST 2007 | cyber_wolf
Hi, We have a UP2000 with grid lok installed on it. We run several assemblies that have component pads close the edge of the board. The side clamps hold the stencil up off the board and we are either getting insufficients or excessive solder paste in
Electronics Forum | Sun Jan 28 22:03:22 EST 2007 | dave
ca anyone help i need to design a circuit which can deliver 18v from 24v the problem is that the "extra" 6v i dont just wanna lose as heat/or lost energy as I have a limited power supply is there an effective way to do this - i have basic el
Electronics Forum | Fri Feb 02 21:31:38 EST 2007 | bill_gates
Hi, I am considering to use pressfit D-Sub and DIN connectors on a backplane. The IPC guideline does just cover pin protrusion for soldered pins, which have to be flush with the board as a minimum acceptable design. Yet, if the backplane may be thic
Electronics Forum | Tue Feb 06 06:41:53 EST 2007 | pavel_murtishev
Good afternoon, You have to use lead paste since none-RoHS components won�t withstand elevated temperatures. Solder paste manufacturers offer a lot of transitional pastes designed specially for mixed process. Ask your paste supplier for transitional
Electronics Forum | Wed Feb 07 07:36:11 EST 2007 | jax
mk, Should I read into the fact that you posted this on a sipad website? You could always add an etch process to you stencil design to gasket around the raised mask locations. It is currently done when additive etch's/trace's are used. The extra $20
Electronics Forum | Wed Feb 14 10:10:55 EST 2007 | rob_thomas
The challenge regarding the stencil was mostly due to the actual board layout and nothing having to do with the voids in the solder. It was my first encounter with 0.5 mm pitch on BGA and dealing with a LF solder paste with higher viscosity than tha
Electronics Forum | Thu Feb 15 21:59:09 EST 2007 | vshan
Hi Jim Good Day yes we are using a pallet bottom support as well as top cover. The top cover are design such a way that the solder paste area is open. the type of solder is lead free type(Avantec-ecorel free) in one panel consists of 28 parts and e
Electronics Forum | Mon Mar 12 08:59:46 EDT 2007 | davef
Questions are: * You say 'voids', but you describe poor barrel fill. Are you seeing both? * Sometimes designers need to reduce the heatsink effect of large ground and power places, but this usually shows on the two upper corner pins, not all corners
Electronics Forum | Wed Mar 14 13:16:54 EDT 2007 | Shane
I have a customer that designed a fine pitch BGA into a board, and has put small vias in the middle of each pad on the PCB. Anyone have any ideas on how I can prevent the solder from the BGA from flowing through the vias and causing voids or no cont
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