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Electronics Forum | Wed Oct 11 05:58:13 EDT 2023 | kojotssss
Hello all, I know there are very skilled guys. Can anyone suggest a stencil design to avoid component displacement during reflow to improve tension of surface forces and selfalignment? There are cases where the inductors are shifted. All parameters
Electronics Forum | Wed Oct 11 13:26:59 EDT 2023 | cyber_wolf
Its highly doubtful that stencil design will fix this. The Inductor floats during reflow and ends up going where it wants to go. The only way you are going to keep it in place is to put a dot of chipbonder beneath it or change the size of the lands
Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef
Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Mon Apr 21 08:55:35 EDT 2003 | russ
The pads you use for Reflow will be be fine for handsolder. Russ
Electronics Forum | Mon Apr 21 21:46:04 EDT 2003 | davef
We agree with Russ.
Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills
Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said
Electronics Forum | Tue Jul 30 05:28:47 EDT 2019 | ameenullakhan
Your inputs are always valuable and help a lot. Thanks for the inputs.
Electronics Forum | Tue Jul 30 09:50:51 EDT 2019 | ameenullakhan
Attached is the image of lead lift in ccga
Electronics Forum | Fri Feb 20 16:34:41 EST 1998 | Jim Humecky Amdahl Corp
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Earl, What are you doing now. What you're suggesting can't be done without trickery. We've been d
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