Electronics Forum | Sat Dec 01 09:12:27 EST 2001 | davef
Ah, there�s the rub. So often we see scoring requirements defined based on depth of cut. This ignores that the depth changes with a variety of factors, including: * Wear on the cutting blade. * Variation in thickness of the fabricated board. So, c
Electronics Forum | Fri Dec 07 09:43:04 EST 2001 | Russ Steiner
I have a mixed technology PCB that has SMT all on bottom, TH parts on both sides (Yes, I realize that's bad. Can't be avoided.) We have designed a 10-up panel, 2 x 5 array. There are 50 leads per bd, 500 per panel. How much time is reasonable to a
Electronics Forum | Mon Dec 31 08:59:36 EST 2001 | Don Adams
The second pass in the wave is pretty extreme and will probably aggravate the conditions which caused warpage in the first place. Areas to look for problems, The lay up of the boards at fabrication or the materials used can lead to warpage. Work wi
Electronics Forum | Mon Jan 07 20:31:15 EST 2002 | davef
While not a Motorola 860 BGA user, we see that on other components. In fact, some of the ErsaScope adverts show the effect. WHAT CAUSES THIS? Generally, the design / layout of the interposer has been the cause of this appearance. IS THIS A CONCER
Electronics Forum | Mon Jan 21 09:27:02 EST 2002 | JohnW
Here's a question for you to mull over. I've got a PCB that is 4 millimeters thick, that's about 160thou of USA money if you like it that way. The question is IPC reg's for hole fill say it should be a min of 75% hole fill and 50% on ground planes. A
Electronics Forum | Mon Jan 28 00:48:21 EST 2002 | peterson
Being in the backplane biz, we too, encounter similar problems...especially when our customer reads the IPC as Biblical (you will achieve 75% fill or be turned into a pillar of salt). Anyway, recently, one of our process engineers suggested paste-hol
Electronics Forum | Tue Mar 12 11:20:08 EST 2002 | BTaylor
I agree with davef on most subjects including this one , we have used a microscope and an experienced inspector for years and done just fine. Recently due to customer demands we an acquired an ASC 3-D inspection station, and it works great it told us
Electronics Forum | Mon Jul 07 21:08:17 EDT 2003 | sam
I have an experience about AOI that it is necessary in a complicated PCB. Due to the final circuit design, the concerned PCB were having nets on the boards, that the Open/Short could not be identified by traditional In-Circuit testers. Some long tr
Electronics Forum | Thu Mar 21 21:21:37 EST 2002 | davef
In the beginning, there was TO-5. And it was good. Flushed with success, they created TO-220. It too was good. Then came SMT. It was better than some things, but then again ... In these early days, there was a haze on the horizon that blocked t
Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh
I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean
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