Electronics Forum | Thu Feb 27 11:05:49 EST 2003 | Chris
Hello, I am the manager of a Drafting department and don�t pretend to know too much about the SMT process. But I am the manager of a CAD designer so I am somewhat responsible for the following issue. So since no one else around here seems to have the
Electronics Forum | Thu Feb 27 17:24:34 EST 2003 | pauld
Forgive the non-SMT question. That's why I hate through hole boards. Has anyone ever used Bareco wax on pressfit connectors, and how do you produce a consistent process for its application? Any drawbacks? Background: We have found a design issue with
Electronics Forum | Fri Apr 18 13:47:19 EDT 2003 | davef
Brian What did we recommend? We just gave you a link so that you can see how to get your pictures on-line, so that we can see what�s going on. Anyhow, if we understand what you saying, [We're slow today. So, please be patient.] your situation is:
Electronics Forum | Tue Jun 03 16:05:58 EDT 2003 | mk
Hi Randy, From a bare board manufacturers stand point, scoring is probably faster and easier but has limitations. If your boards are square or rectangle scoring will work fine. Once assembled the scored grooves can be sliced apart using what is some
Electronics Forum | Fri Aug 08 18:00:34 EDT 2003 | kenBliss
Hi Bman At the risk of coming off as a �sales type�, you appear to be looking for a solution provider and probably opinions on your ideas. Regarding your method mentioned, This is not the most efficient way to run a stockroom but will work and will
Electronics Forum | Mon Oct 13 13:34:13 EDT 2003 | caldon
HI Andrea- to answer Q: 1) Stencils can be order through various vendors that manufacture stencils. You would need to have CAD data for the Stencil company to make them. You design engineer should have the CAD info. Also, the stencil design company c
Electronics Forum | Fri Apr 09 01:41:35 EDT 2004 | Mike Konrad
Although water soluble (OA) flux is technically the easiest flux to remove, it is also the most damaging type of flux if not removed. A dishwasher lacks the pressure and nozzle design to produce the very small water particle size required for thorou
Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz
Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Mon Nov 22 17:32:34 EST 2004 | davef
Assemblers often assume that the board and component suppliers provide them with clean product. This was not a problem when everyone used water washable fluxes, because the water washing used to clean the flux residues also cleaned the board and com
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