Electronics Forum | Fri Aug 27 13:34:25 EDT 1999 | Brian Larson
If your through holes are overlarge or the anular rings too small, the surface tension of the wave may exceed that of the joint. I would look at the design. You may want to put a strip of kapton tape on the following edge of the panel to test the "
Electronics Forum | Fri Aug 27 14:38:54 EDT 1999 | Doug
Brian, Thanks for the input. The hole size is good but the anular ring is small. I have helped the condition by reducing the clinch on the LED's. This I believe is reducing the pull out path. Thanks again | If your through holes are overlarge or th
Electronics Forum | Thu Aug 26 10:27:41 EDT 1999 | Wolfgang Busko
| | | I rotated my PCB -90 degrees. Now what's the formula to calculate the X-Y Coordinates of my component CAD Data? | | | | | | Thanks, | | | | | Not very difficult | | | | (Subscripts n = new, o = old) | | | | Assuming the same origin: | | |
Electronics Forum | Wed Aug 18 16:15:04 EDT 1999 | Earl Moon
| Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf | I
Electronics Forum | Tue Aug 17 10:21:32 EDT 1999 | Steve A
It may be worth mentioning to those that do not have the ability to rotate the PCB, that some folks adjust their aperture design on fine pitch leads by increasing the aperture size for those leads parallel to the X axis, thus allowing consistent volu
Electronics Forum | Thu Aug 05 04:32:21 EDT 1999 | Wolfgang Busko
| I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc.
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE
| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
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