Electronics Forum | Thu Oct 03 10:21:30 EDT 2019 | cbart
Hello all!! we are having a heck of a time getting a TE Connector to solder TE P/N 2305018-2. the part design is terrible!! the parts tips forward and rocks side to side when mounted. we are getting many un-soldered leads. and the design does not len
Electronics Forum | Mon Feb 14 12:41:56 EST 2000 | Dave F
Dek has the more robust design for their paste dispensor.
Electronics Forum | Mon Dec 04 12:25:21 EST 2000 | nightbull
I would like to know what IPC standards to order for Manufacturing and Design guidelines for BGA? Are there two? Thanks.
Electronics Forum | Mon Dec 04 12:24:59 EST 2000 | nightbull
I would like to know what IPC standards to order for Manufacturing and Design guidelines for BGA? Are there two? Thanks.
Electronics Forum | Tue Dec 05 10:35:39 EST 2000 | Gil Zweig
See IPC-7095, "Design and Assembly Process Implementation for BGAs"
Electronics Forum | Tue Nov 07 13:46:07 EST 2000 | Chad n
Are they tools designed for removing dross from the solder pot?
Electronics Forum | Wed Oct 25 06:14:14 EDT 2000 | Adam
Guys A question regarding design rules of a WSC.We are currently running a high volume product, and as usual the design layout is as such where half the through hole connectors are perpendicular to the wave, and surprise,surpise the other half are'n
Electronics Forum | Tue Jul 25 20:36:58 EDT 2000 | Dave F
Sal: When western companies first started studying Japanese companies, they found the Japanese using a technique called "poka-yoke." It means mistake-proofing. In this, the designer specifies parts and assemblies so that they can be assembled one
Electronics Forum | Tue Jun 13 12:26:11 EDT 2000 | Todd Murphy
I am looking for opinions on soldermask between the lands of fine pitch components =
Electronics Forum | Wed May 10 23:28:05 EDT 2000 | BB
Have you look into the profile setting or the pad design, these are possible causes of tombstoning.
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