Electronics Forum | Thu Apr 29 11:07:03 EDT 2004 | arcandspark
You are right about the very poor support for smaller customers. I had told them we were looking for another paste and now they have sent the reginal manager and the US sales manager has come by to see what they can do for us. All they keep saying is
Electronics Forum | Mon May 24 05:53:24 EDT 2004 | johnwnz
Here's an interesting fact, some pastes just don't wet as well as others!.. there I've said it and now people will complain but that's life. Some pastes are formulated to run in air, some in N2, soem are specifically designed to be more aggressive fo
Electronics Forum | Sat Jul 17 10:04:39 EDT 2004 | stefwitt
I think we should shift this issue to the machine suppliers, requesting changes in the machine design, in order to keep at least the jobs of high mix, low volume in this country. We can only compete with low labor cost countries by increasing the lev
Electronics Forum | Tue Sep 14 11:26:18 EDT 2004 | Simon UK
Hi All, Ok, now i have hit a brick wall with our design department and due to limited space on our standard sized boards we are going down the Double-Sided route. We have a 8 zone (4 Top/Bottom) Quad ZCR Convection (Ok! you can stop laughing!) and
Electronics Forum | Fri Sep 24 12:20:58 EDT 2004 | Simon UK
Hi there, I have been using DEK's of all types over the past 9 years, with a few SMTech's and MPM's thrown in for good measure. I personally would recommend using DEK, they may seem expensive, but i find that worth the cost with the good support we
Electronics Forum | Mon Oct 18 22:15:11 EDT 2004 | KEN
I have two industry leading customers that have specific requirements for components to survive 30 seconds above 230C. In one case I have a custom ASIC that is heat sinked on the die (to the PCB). The sink pulls heat out of the lead frame very effi
Electronics Forum | Wed Nov 03 09:18:27 EST 2004 | Simon UK
Hi Dennis, It is all dependant on what you state for the class of product i.e. Class 3 is the top end acceptance criteria used mainly in Aerospace and Military. You have 2 terms you need to grasp to avoid confusion. 1. Acceptance Criteria 2. Target
Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
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