Electronics Forum: designation (Page 236 of 537)

Pick & place

Electronics Forum | Tue Mar 27 08:49:57 EDT 2007 | slthomas

If by 15 mil accuracy you're looking to place 15 or 16 mil pitch, yeah, you're asking a lot of a IVc. Ours do OK for 20 mil pitch but I wouldn't want my living to depend on placing high volume ultra fine pitch with it. They're not designed for that.

Product qualification by product families

Electronics Forum | Tue Mar 27 06:50:25 EDT 2007 | Ayelet

Hi, Are you familiar with any spec that defines choosing product families for the various qualification (DVT, HALT, EMC, Environmental qualification etc). Meaning: if I have many products, all manufactured on the same production line, but have, of

SMT fuse clips

Electronics Forum | Thu Apr 12 20:27:28 EDT 2007 | stimpk

What is part vendor? Can you look that up and determine supply type etc tape/reel/bulk etc... Does it have a design/surface that a SMT nozzle can consistantly pick from? We place thousands of differents clips with ease. If your part can be picked and

0402 aperture design lf

Electronics Forum | Tue Apr 24 02:56:12 EDT 2007 | chrispy1963

If the PCB you are using is a HASL pad finish and is a leaded assembly, we use homeplate pads with a 5 mil stencil. If the circuit has Enig finish and is PB-Free then we use 1:1 apertures with a 5 mil stencil Either method should provide no solde

Kester paste problems

Electronics Forum | Tue May 22 12:27:04 EDT 2007 | cyber_wolf

I would consider calling Kester and telling them they need to send their people out. I could not really see mesh size being an issue on anything 20mil and above. There are several other issues that can cause aperture clogging as well...: Incorrect

Small Batch PCBA Cleaning

Electronics Forum | Thu May 31 02:38:12 EDT 2007 | Mike Konrad

The �usual suspects� Aqueous Technologies www.aqueoustech.com Austin American Technology www.aat-corp.com EMC Global Technologies www.emcgti.com Unit Design www.unitdesign.com All of the above companies manufacture �batch� format automatic deflu

Reflow Profile Design

Electronics Forum | Fri Jun 15 11:34:49 EDT 2007 | cman

What is the board finish? Did you profile built assy and get the temps on the board with a t/c in the board? DId you drill the BGA and get the t/c at the ball? When the parts came off the board did all of hte solder come off the pads and stay with th

Reflow Profile Design

Electronics Forum | Sat Jun 16 02:44:21 EDT 2007 | gsala

Hi Grant, it seams your PCBs are ENIG (Gold)finished, correct? If yes, did you considered the quality of PCB, for istance are you sure are there any black pad evidence on BGA pads? When BGA drops away like that, one of the potential cause can be a

Reflow Profile Design

Electronics Forum | Sat Jun 16 07:48:09 EDT 2007 | grantp

Hi, We are using emerson gold, and I have not seen any evidence of black pad, as the pads are clean and gold colored when the part comes off. That is what worried me, as I would have thought that if the solder melted correctly, it would have stuck t

Reflow Profile Design

Electronics Forum | Mon Jun 18 10:20:14 EDT 2007 | ck_the_flip

Grant, i have heard of a few cases where the PCB is "reworked" by the PCB house, where the immersion silver that did not wet to the base copper was reworked by just putting immersion silver on top of the non-wetted immersion silver. I know your PCB


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