Electronics Forum | Thu Jul 17 22:33:31 EDT 2008 | gdzuber
Greetings, I have to agree with others here. If the system is under warranty get them back in and have them fix it. I work for another oven manufacturer and we would take care of this under warranty. If it is a design defect we might fix it for free
Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang
Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi
Electronics Forum | Mon Aug 11 08:47:31 EDT 2008 | davef
Your MPI (Inspection Procedure) is certainly flawed. Your MPI should have caught this on the first board your produced, before it was reflowed. For help convincing yourself the part is rotated 180*, your choices are: * Get the pin-out of the compone
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Fri Sep 12 08:22:31 EDT 2008 | davef
Your supplier is probably the best source of advice on this issue. Some offer tips like: http://www.n0ss.net/hakko_808_notes.pdf Depending on the design, some use grease to reduce air leakage on: * Filter tubes * Gaskets or O-rings * Threads We ha
Electronics Forum | Tue Sep 16 14:03:41 EDT 2008 | mi
Stephen, When I port from Mydata to AOI machine, I use an Excel macro that lays out data into 5 fields/columns per line as: X Y angle P/N Reference Designator Is this the same for Panasonic? I'll also ask Panasonic operator if this is what he cou
Electronics Forum | Tue Sep 16 13:40:20 EDT 2008 | ck_the_flip
Try reductions in the "Y direction". For the SMALL PAD, go from 16-mils to 14-mils, and on the large pad, you can play around with reductions on the 14x24mil pad...or try mesh pattern. You'll be well with area-ratio guidelines with both approaches,
Electronics Forum | Tue Sep 16 16:47:32 EDT 2008 | wavemasterlarry
All this nonsence talk of ratios drives me nuts.you guys should be do-ers and quit reading all these whitepapers. I fancy myself as be-ing from that school of hard knocks.No math or ratios needed for that. Speaking of hardknocks I'm in the Texas area
Electronics Forum | Tue Sep 16 16:55:51 EDT 2008 | rayjr1491
I am a doer myself but with the turn around and cost on EFORM stencils I prefer to be right and starting with math is always the best way. We have played with reducing apertures even stencil thickness as low as 4 mil. On the side that this component
Electronics Forum | Tue Sep 16 17:56:36 EDT 2008 | slthomas
"....over 3500 apertures in a circuit that is about 1 x 1.5 inches..." 8O Yeah, Larry would definitely be the go-to on this one. :P I would think reducing stencil thickness would be your best bet to avoid that ratio problem, but how durable is a .
