Electronics Forum | Thu Feb 24 14:03:59 EST 2000 | John Cudmore
Brian, The SRT FPD-W is an older unit that has been successful for a long time. We have used it at BEST with good results. The SRT FPD-W is a very good machine for the uses you mentioned except possibly for the BGAs. I have seen some used for BGA
Electronics Forum | Thu Feb 17 22:23:15 EST 2000 | Dave F
Richard: As Roni said, most of the better profiler companies have the capabilties you seek Datapaq,187 BallardvilleSt,Wilmington, MA 01887 508.988.9000 Michael Dougherty Electronic Controls Design, 13626 SFreeman Rd, MulinoOR 97042 503.829.9108 K
Electronics Forum | Wed Feb 23 20:29:43 EST 2000 | Rex B
ECD is working on some tools in the area of determining the Ideal or most Robust Profile, for a given paste, oven configuration and conveyor speed. Translation of this "most robust profile" into actual oven setting requires more knowledge about the
Electronics Forum | Wed Jan 31 09:44:26 EST 2001 | BLNorman
I listed this under design, but got no responses, so I'll try this forum. Our current solder paste vendor wants us to evaluate a paste. One of the selling points is that this paste (SnPb) will have the same flux package that will be used with some o
Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Tue Feb 13 14:59:48 EST 2001 | vargas_s
I have an application where a customer cannot get a 14 lead TSSOP device in time for his needs (his board design is fixed). He can however get the same device in a 16 lead SOIC wide body package (two leads are not used). Has anyone come across a cost
Electronics Forum | Tue Feb 20 16:51:22 EST 2001 | davef
You should evaluate products from Datapaq, Electronic Controls Design, and Kic Thermal Profiling. Each sells very good reflow profiling equipment. Beyond the straight forward issues surrounding the question of "Does this thing produce a good profi
Electronics Forum | Fri Mar 02 06:25:04 EST 2001 | PeteC
Thanks for your feedback. All the 0603 chips have the round solder lands but the 0805 chips and larger are rectangular. After speaking with the designer on it he said they chose round lands for the 0603 chips to get higher density of the circuit trac
Electronics Forum | Mon Feb 26 14:15:21 EST 2001 | marting
Steve, Currently we are using selective pallets and the best piece of advice is to find a supplier that will be able to handle the requirements of the selective wave process, for example proximity of chips to PIH devices, and pallet thickness etc. We
Electronics Forum | Mon Feb 26 20:22:01 EST 2001 | davef
As a design rule, provide 0.050" minimum between parts to be "masked" and areas that require wave contact. The more the better is the general rule to apply. Check: http://www.autogroup.com/designguideb/ http://www.spprecision.com/ http://www.datumdy
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