Electronics Forum: designation (Page 376 of 537)

Re: BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 21:18:27 EDT 1999 | Scott McKee

| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa

Why Bar Code?

Electronics Forum | Wed Jul 14 17:03:15 EDT 1999 | John O'Brien

I'm doing some basic research in trying to understand the purpose and drivers that cause bar code (or other) marking of PCBs. I would appreciate any knowledgable volunteers willing to speak with me -your name, number, the best time for the call- or r

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |

Re: dispensing paste for rework

Electronics Forum | Fri Jul 16 14:02:03 EDT 1999 | Timothy O'Neill

| Earl, | | Srt makes a system called the summit 2100D. Its a relatively new product but it is designed for rework applications. The programming is simple and interfaces well with other srt products. As with any dispensing system, you have to cl

Reflow Oven Capability Study

Electronics Forum | Wed Jul 07 16:56:43 EDT 1999 | John Zizzo

Hi! I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board uniformity h

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 13:41:42 EDT 1999 | Dave F

snip | | If you go for plugging be sure you have a protrusion spec that you can live with. This often results in little bumps of epoxy that can interfere with component placement. For us, tenting .015 vias usually gets us about 80% coverage from

Re: Sub-contractor selection

Electronics Forum | Tue Jul 06 12:46:27 EDT 1999 | John Thorup

| | We are looking for some subcontractors to do surface mount | | technology boards for us. Is there anything I should pay specific | | attention when I visit the subcontractor's site? | | Thank you for any advice | | | Wolfgang has a good poi

Re: pitch

Electronics Forum | Sat Jun 05 07:37:25 EDT 1999 | Dave F

| We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | John: Never heard of an "SOAC." SO packages are 50 ptch (50 mil, 1


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