Electronics Forum: designation (Page 46 of 537)

SOD 923

Electronics Forum | Mon Mar 25 13:29:50 EDT 2013 | emeto

Also Guys if you can share what do you recommend as an apperture design would be great.

Glue stencil appertures

Electronics Forum | Wed May 08 09:15:05 EDT 2013 | emeto

Hello, I am wondering what are the design rules for glue stencils?

Glue stencil appertures

Electronics Forum | Wed May 08 21:43:12 EDT 2013 | davef

IPC-7525A - Stencil Design Guidelines

QFN PCB Pad no Drain Hole

Electronics Forum | Tue May 21 09:16:28 EDT 2013 | hussman

What size QFN? What stencil design and thickness are you using.

Paste printing fine pitch components

Electronics Forum | Mon Oct 14 14:35:51 EDT 2013 | garym4569

Thanks for the replies. I have just ordered the IPC Stencil Design Guidelines manual.

SMD Via hole design-thermal performance

Electronics Forum | Sat Nov 01 09:40:05 EDT 2014 | davef

Papers: GOOGLE thermal pad via

PCB Design

Electronics Forum | Wed Aug 12 09:32:01 EDT 2015 | technotronix

Did you try finding out different tools from eBay or amazon?

Regarding the Footprint designing for Wire bonding technology based Microntroller

Electronics Forum | Fri May 29 07:17:02 EDT 2015 | anirudh_thabjul

Hiee everyone, I am a Hardware Engineer and also a PCB designer. I am using a Microntroller which is in "CHIP PACKAGE". So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology". So, Can any one suggust 1. whi

BGA pad design

Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk

In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t

BGA pad design

Electronics Forum | Wed Jan 27 04:01:46 EST 2016 | slouis2014

Thanks alot for the info


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