Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Tue Jun 23 13:33:23 EDT 1998 | Ben Salisbury
| Ben: Nice answer, but what's a DOE? How do you run one? What other processes do you run DOEs on? Dave F DOE=Design of Experiment Tools used for DOE...Multi-Vari Charts,components search, Pair comparisons, Variables search,Full Factorials, B vs.
Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis
There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. | R&D is currently designing a board with smt components on both sides of the bo
Electronics Forum | Tue Jan 27 08:08:51 EST 1998 | Jon Medernach
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Mon Jan 26 08:58:05 EST 1998 | Mike McMonagle
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Mon Sep 10 13:44:43 EDT 2001 | Hussman
Hello All! I've been asked to change a current design using a shield. Currently we build it by using silver epoxy adhesive to make electrical connection. Just wondering if anyone out there has a experience with using surface mount clips that hold
Electronics Forum | Mon Sep 17 05:18:48 EDT 2001 | V.RAMANAND KINI
Hello! PRO-E is a mechanical design software. It itself has a export to *.bmp (bit map image) facility. It also has many export facilities. Once you have exported it to bmp then you can use the insert command in the word document to insert that bmp
Electronics Forum | Tue Sep 25 12:49:58 EDT 2001 | Hussman
Been there - done that. Makes a mess on that 2nd reflow process- doesn't it!?!?!? This is caused by design. If the open via is located in the land area, it will flow thru the via and cause pumps on the opposite side. You can have your vias filled
Electronics Forum | Fri Oct 12 14:19:03 EDT 2001 | David Brink
Steve Often solder mask is the only solution but in many cases there is enought space between smt and thru-hole to utilize a component masking wave solder pallet. The advantage to a pallet is consistancy of results and excellent protection of masked
Electronics Forum | Fri Nov 09 11:22:43 EST 2001 | denis
We are a contract manufacturer and we do business with a big company. There is a mistake in the design of the PCBs they are supplying: the pads are too long (under the component) and sometimes we get short circuit we cannot see. Changing the design w
