Electronics Forum | Mon Dec 18 10:49:20 EST 2000 | marys
When reading about the design of high performance cicuits I have recently encountered references to bromine free circuit boards. What are bromine free circuit boards? When would one find them most useful and who supplies such boards?
Electronics Forum | Thu Oct 26 13:10:48 EDT 2000 | ptvianc
Yes, one should always be concerned about "field failures" because they represent the point at which the product has exceeded its design lifetime with respect to its service conditions. Hybrid microciruit technolgy (HMC) has been around for a long t
Electronics Forum | Thu Jul 20 14:25:03 EDT 2000 | Bob Willis
Better design for manufacture Better education for engineers in manufacture at college and university Realising that there is just so far you can push FR4 laminate Finding a way of making all the knowledge in our industry available to those future en
Electronics Forum | Thu Jun 22 15:50:53 EDT 2000 | Dave F
Lee: Here is two materials related questions: Taking a long term view, how are preferred materials selected from a design for the environmental perspective? What are the criteria for determining if a material is recyclable? Who does this?
Electronics Forum | Tue Jun 06 13:19:31 EDT 2000 | ZAKIR AHMAD
Our company do electronic packaging for space applications. One of the problems we face during our design is whether or not to stake/bond the surface mount components to the board to survive the vibration qualification environment. If we do staking
Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef
Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.
Electronics Forum | Thu May 24 17:42:44 EDT 2001 | davef
Darn good point!!! * Accu-System [ 3100 VSC] 215-830-9826 * Radoll Design Score Depth Indicator http://www.radoll.com
Electronics Forum | Mon Jun 11 21:27:43 EDT 2001 | procon
Way to go CPI! This is a classic example of design. Many people experience this when the have an 0402 close to a QFP or other large components. The pad closest to the larger component will become liquidous later than the pad farthest. Hence, a new t
Electronics Forum | Thu Jun 14 16:33:32 EDT 2001 | pr
I have found all the advantages (that others have spoken about) are true. One thing to look at is the quick disconnect system that MPM offers which will reduce changeover times to almost the same as blades. It's well designed and so far, for us, has
Electronics Forum | Wed Jun 13 21:31:27 EDT 2001 | davef
Lotsa ways to bust caps. First: placement force; Second: thermal stress; Third: poor pad design. Forth: then, ummm maybe the cap supplier. Please describe the crack in more detail. Where does the crack start? Where does the crack go?
