Electronics Forum | Tue Nov 06 10:06:33 EST 2018 | davef
Electronic Connector Industry News Resources + Surface Finishing + Metal Finishing + Products Finishing + Interconnection World (Connector Specifier) Electronic Connector Associations + IEEE USA + International Electronics Manufacturing Initiative (
Electronics Forum | Thu Apr 04 09:45:58 EDT 2019 | davef
That's what I guessed. Some ideas to consider are: Reduce usage of flux to the bare minimum. Choose a low solids flux Flux residues can be categorized as soft, brittle, sticky but this depends mostly on the formulation of the flux and the resins
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Fri Jul 26 06:16:02 EDT 2019 | spoiltforchoice
We have enough volume/oversized products that batch vapor doesn't quite work. Once you move into the quasi inline or fully inline vapor system they become eye-wateringly expensive. Plus you get an entirely new process to learn, potentially increased
Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
Electronics Forum | Mon Jan 06 20:53:23 EST 2020 | mikeyg12
Hello everyone! I have had this idea in my head to DIY a desktop KVM (without the V so I guess just a KM) board that I can solder USB A headers to with a DPDT switch. I designed the board and when I thought it was all good to go I proudly sent it of
Electronics Forum | Mon Feb 10 10:41:29 EST 2020 | SMTA-Tony
Hello Phil, As the other respondents have mentioned, the cooling rate is not easily controlled and varies based on the oven and board design, as well as the settings of the last few zones and cooling zones. In general, the board is going to cool in
Electronics Forum | Wed Apr 15 18:37:15 EDT 2020 | unisoft
The point here is if you can't get the full CAD files or the XY rotation files and all you get his Gerbers and a BOM. Most all contract manufacturers and some OEM's at some time or another have to deal with Gerber only files. If you find yourself i
Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076
https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting
Electronics Forum | Tue Nov 23 18:59:14 EST 2021 | kumarb
Hi. To add to your homework... 1) RPS are from the former team that developed the ACE KISS product line. 2) From brief chats, NORDSON is still building the last versions of the ACE KISS designs while RPS has continued to advance the tool. 3) Anoth
