Electronics Forum: designed (Page 201 of 537)

PQFP with pitch of 0.4 mm

Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef

Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past

Round Solder Lands

Electronics Forum | Mon Feb 26 07:19:47 EST 2001 | PeteC

Has anybody ever seen round solder lands for 0603 chip components? I've got a new board to build and it has round lands. I've asked the design enegineer why he chose round lands. Waitin for the answer. And the funny thing is all the 0603 chips don't

Component orientation into the reels

Electronics Forum | Thu Mar 01 16:58:05 EST 2001 | davef

Last time we looked at this, JEDEC carefully designated the dimensions of the carriers, but "neglected" to define the component orientation with the carrier. Go to http://www.jedec.org/download/, search for JEP95 JEDEC REGISTERED AND STANDARD OUTL

0402 placement using Quad 4C

Electronics Forum | Tue Mar 13 12:33:35 EST 2001 | Simply Anonymous

Try calling Quad, I know that they were in development of a feeder designed specifically for 0402. The problem has always been the pick of such a small part, but the placement is very reliable. By way, have you heard that Quad is being purchased by

Bottom side process question

Electronics Forum | Fri Mar 16 17:50:45 EST 2001 | djarvis

Steve, I did this several years ago on a terribly designed board that left a lot of joints unsoldered after the wave. It works OK. This was a bog Irish board with nothing fancier than SOP packages. Glue was Amicon D125. Happy St. Patrick's Day everyo

Selective pallet thickness

Electronics Forum | Fri Apr 13 14:51:01 EDT 2001 | Mike R.

Some Selective wave solder jig designer milled down the jig in one depth which is based on the thickest part on the bottom side of the board. This will create problem on the warpage on the jig due to the heat coming from the wave soldering machine. I

Pad Geometry Design Standards

Electronics Forum | Sat Apr 14 03:34:23 EDT 2001 | kpliew

Hi Greg, If u don't mind my recommendations. U may want to try to convince them that by using smaller pad size , u save solder paste in the end of the day (provided u are doing mass volumes). It is another way of getting around to ur idea of changin

Cleaning no-clean residue

Electronics Forum | Tue Apr 17 11:00:55 EDT 2001 | Steve

I have struggled with this myself. Usually where the pressure to clean the residue off is from the people who see the residue but do not understand the characteristics. I have not found a reason to clean residue off. A few people from our design gro

0201s

Electronics Forum | Thu Apr 19 21:49:29 EDT 2001 | davef

SCREENING... 1. Is type 4 paste necessarily required? [No, not unless you are using it for some other purpose.] 2. Is No-Clean Ok to use? [YES] 3. How thin stencil is required? 5 mils? [5 is OK, but I wouldn�t base the decision on the 0201. 6 mil is

Mydata vs Siplace

Electronics Forum | Mon Apr 23 10:02:47 EDT 2001 | Cal

Mydata machines are great for large back planes close to 23" wide. The foot print of the Mydata machines are concerning- being a "T" design it sacrifices floor space. Also, Mydata is not considered to be in the same classification (my opinion) of equ


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