Electronics Forum: designed (Page 306 of 537)

Mirrored BGA Assembly

Electronics Forum | Thu Jul 15 12:02:38 EDT 2004 | Yngwie

We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl

25 mil QFP soldering issue

Electronics Forum | Tue Jul 27 11:32:20 EDT 2004 | dwanzek

Thanks for the input guys. One problem with this theory, we see the same failure using Omni 5000 solder paste. We also see this problem across 4 production lines, suggesting it is not oven related. The profile meets recomendations and we have tried

Multi-part reeling for pick and place

Electronics Forum | Sun Jul 18 14:01:25 EDT 2004 | KEN

Unfortunately, smt machines are not like TH sequencers. But, that is in their favor. Multiple reels, multiple part types, many positions = very flexible. Offline setup is paramount to line utilization. Remember, you only make money when the machi

Mirrored BGA Assembly

Electronics Forum | Fri Jul 16 03:35:34 EDT 2004 | Yngwie

We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl

Warming up solder paste at start of days production

Electronics Forum | Tue Jul 27 01:48:41 EDT 2004 | Grant

Hi, Ok, and I will check that out. We do treat the solder paste as a perishable now, and after each day's run, we throw used paste out. That's helped a lot overall. I agree on the hot dog rollers. I have always thought those things were a cool, but

Lead Free Wave Soldering

Electronics Forum | Fri Jul 23 05:03:31 EDT 2004 | loz

I'd be interested to hear what the PWB vendors have to say about your comments. This is something I have questioned before, but I fail to see how this problem can be proved. Because of all the technicalites of the wave soldering process, it is someti

ENIG Finish for BGA Designs

Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef

Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri

Straddle Mount SMT connectors SCA-2

Electronics Forum | Wed Aug 18 06:34:57 EDT 2004 | Bernard Mulcahy

Hi , Our hardware designer wants to introduce a board with a straddle - mounted SMT connector, AMP part number 84487-1 and FCI 71292-001. This is an 80 pin connector that slips over the edge of the PCB and has 40 SMT pads on either side (at least thi

Looking for Filled via -- Embedded within pad - criteria

Electronics Forum | Thu Sep 02 15:51:15 EDT 2004 | cburress

All: IPC does not directly state any criteria for physical characteristics of what a filled via should look like when embedded within a surface mount component's pad. I am using several of these in my design, and have received PCBs that exhibi

Component location related to Fiducial marks

Electronics Forum | Fri Sep 10 00:13:48 EDT 2004 | Darren

Joe If you are building these yourself your engineering group should be able to answer your questions, if you will be using a CM they will usually have a basic DFM report which they will gladly give to you as it will make their job much easier if yo


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