Electronics Forum | Thu May 07 17:50:41 EDT 2009 | ecad
Hi, I'm a newbie here but I've lurked about this forum in the past! I'm an experienced PCB Designer I've found myself out of work due to the economy so I'm attempting to start out as a freelancer, I've found that more than a few of the smaller R&D fi
Electronics Forum | Tue Jun 02 21:27:22 EDT 2009 | davef
We've never heard of a situtation where oversized pads caused voiding. Your supplier is correct that the pads on the board should be the same size as the pads on the interposer, but this is to improve reliability issues. Search the fine SMTnet Archi
Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito
Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s
Electronics Forum | Mon Jun 01 18:44:54 EDT 2009 | scunneen
Hello there, I have a new board, fairly heavily populated with a number of FPBGA on it. The smallest has a pitch of .4mm.I have 3 questions, 1st what is the best appeture for this small pitch. 2 Will type 3 paste work or will I need type 4, and fina
Electronics Forum | Tue Jun 02 20:47:12 EDT 2009 | isd_jwendell
I was hoping some-one would help you with this because I too would like more information about selecting stencil thickness. I have read some about apperature ratios, but this alone doesn't appear to be the only factor when chosing stencil thickness,
Electronics Forum | Wed Aug 05 23:02:09 EDT 2009 | mrduckmann2000
Help! We are havin issues installing the new Linear Tech LGA118's. We are installing 17 of these beast per assembly, the problem shorting? Any ideas? Linear Tech is usless, they blame heat, not a big enough reflow oven, moisture, part disty's...e
Electronics Forum | Mon Aug 24 07:32:34 EDT 2009 | hurr
Hi Joane, this flux is primarily designed for wave soldering. I think that manual soldering it´s possible. Certainly it´s very hard to dispensing correct amount of the flux. Succinic acid is one from all ingredients of this flux. If you have this
Electronics Forum | Tue Nov 10 17:01:17 EST 2009 | jjune
2 days?? WOW! Here at our location, with MyData programming it takes on average for new projects a little over an hour with over 350 new parts. We use Aegis for both our offline programming as well as our MES and definitely have been happy with th
Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef
Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.
Electronics Forum | Tue Oct 13 12:32:43 EDT 2009 | davef
2.6.3 Test Pad Location Tolerances, third bullet. Why does Entek require different test point spacing than other surface finishes? Page 55, top image is off the page, partially. 2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers
