Electronics Forum | Wed Jul 20 16:51:03 EDT 2005 | pjc
There is a spec I read that states +/- 0.001" (0.025mm) print deposition accuracy and repeatability is more than adequate for 0201-chip printing. I don't think any print studies where done for 01005 chips yet. There are several other factors besides
Electronics Forum | Wed Sep 07 10:34:52 EDT 2005 | PWH
Have experienced this on a few different cap. parts. Agree with other postings. Following are solutions to problems we have had: 1) Cracked cap too close to board edge per IPC spec. Designer replaced part with 3 caps in series to eleviate stress
Electronics Forum | Sat Mar 11 15:05:54 EST 2006 | Kerm
Hi Craig: I agree with muse. The problems almost always will show up later on duringg life cycles in terms of reliability problems. While the solder joints may look acceptable right after production there is no guarantee of meeting the reliability r
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Fri Dec 08 02:40:45 EST 2006 | Mike Konrad
Hi 'K', We manufacture both batch and inline defluxing equipment so we have no axe to grind with either technology. There are pros and cons associated with both technologies under specific conditions. Batch machines are typically good cleaners but
Electronics Forum | Sun Jan 28 13:26:27 EST 2007 | Sweet Old Bob
Okay you CM haters I don't see anything about the design of the board, other than OSP which is strike one. What is the board size? What is the board thickness? Where is the BGA located on the board? What is your ball to pad ratio? What is your aspect
Electronics Forum | Mon Feb 19 22:56:20 EST 2007 | davef
Russ We agree with your comments on plugging from one side only. But... We believe that it IS possible to trap process chemicals [technically, not flux] in a blind [or any other] via. This can be done by plating the via closed, rather than pluggi
Electronics Forum | Mon Mar 12 14:19:16 EDT 2007 | Grant
no offense Grant--I was designing P & P equipment and vehemently studying > competition when your mother was still wiping your nose...I was just ? >responding to the previous comment about footprint and feeder capacity--for > which there is no equal
Electronics Forum | Mon Mar 12 08:24:30 EDT 2007 | rgduval
ICT is generally a manufacturing verification test. Coverages vary depending on the board. I've run lots with as low as 25% coverage on the board (but produced 98% FPY post board assembly). Functional test is exactly what it sounds like. Checking
Electronics Forum | Sat Mar 24 12:30:20 EDT 2007 | John B.
We're currently running a manncorp ECM-93, which has served us alright, but we've pretty much outgrown it. We manufacture power electronics, a lot of double sided designs with odd form parts. We have about 30 different designs we manufacture, and we
