Electronics Forum | Thu Nov 19 11:59:58 EST 1998 | Dave F
| I have a requirement to reform the legs on flat pack devices (en-masse) due to materials handling problems. I am aware of the pitfalls in reworking any IC in this way however I have no choice in the matter. I have found one suitable machine on the
Electronics Forum | Wed Nov 11 04:49:31 EST 1998 | B.D.
| Some placement machines has WindowsNT userinterface,and | some has another type of userinterface. | Although I think the WindowsNT is better for engineers, | it seems not so friendly for some machine operator. | How much is the WindowsNT important
Electronics Forum | Thu Oct 29 11:15:58 EST 1998 | Scott B
| | Does anyone know of any software programs that will verify a Pick & Place program to the Bill of Materials (BOM)? Verify meaning the Part # and Ref. Des. matching of the two files. | | We use GCPlace to merge our BOM with X/Y file | but ocas
Electronics Forum | Mon Oct 26 20:18:23 EST 1998 | Dave f
| I need some info on how to stop the bridges I'm having on | radial and axial parts that are in the same place on every board. I'm also having problems with sot-25 bridging. I'm using a Electrovert E-pak. I tried leveling the machine,solder pot, an
Electronics Forum | Mon Oct 19 13:32:06 EDT 1998 | Mark Schwarz
| How are solder pastes manufactured right from the level of extracting lead and tin ? | | | The Tin Institute is good but I rarely find that the raw metals industries guys know about pastes. Making a tin-lead alloy for pastes, as for raw bars, is
Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.
Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac
Electronics Forum | Thu Oct 01 11:40:17 EDT 1998 | Justin Medernach
Are there anyone who can give me the answer about solder ball problem? | We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. | So
Electronics Forum | Wed Sep 30 15:27:34 EDT 1998 | jvo
I've been looking for a vision system which can check our fully mounted boards containing a mix of smt and thru hole. The concepts on all the machines are virtually the same, they got about 12-16 cameras, some pcb fixing and the rest is software.
Electronics Forum | Wed Sep 30 16:36:59 EDT 1998 | Dana R Simon
I've been looking for a vision system which can check our fully mounted boards containing a mix of smt and thru hole. | | The concepts on all the machines are virtually the same, they got about 12-16 cameras, some pcb fixing and the rest is soft
Electronics Forum | Sun Sep 27 13:32:59 EDT 1998 | S. Evers
| | I am looking for anyone out there that has had experience with stenciling with chipbonder adhesives. I need information on material and stencil design. | The firm who can help is K&J marketing their new KEPOCH stencil material is a (plastic) pol
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