Electronics Forum | Fri Nov 27 08:58:39 EST 1998 | Des
I have a PCMCIA type pcb with an 0603 resistor situated exactly half way along the longest edge the device is 2mm form the edge of the pcb. I have experienced incidences of the device fracturing after breakout (hand operation) (pcbs are routed) Coul
Electronics Forum | Tue Oct 06 09:06:35 EDT 1998 | MMurphy
| I am looking for anyone out there that has had experience with stenciling with chipbonder adhesives. I need information on material and stencil design. Go to the Stencil Design Guidelines page under the Technical Information section of the alphas
Electronics Forum | Tue Aug 04 10:44:41 EDT 1998 | Chrys
| | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | Also, has any one
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Tue Jun 23 13:33:23 EDT 1998 | Ben Salisbury
| Ben: Nice answer, but what's a DOE? How do you run one? What other processes do you run DOEs on? Dave F DOE=Design of Experiment Tools used for DOE...Multi-Vari Charts,components search, Pair comparisons, Variables search,Full Factorials, B vs.
Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis
There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. | R&D is currently designing a board with smt components on both sides of the bo
Electronics Forum | Tue Jan 27 08:08:51 EST 1998 | Jon Medernach
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Mon Jan 26 08:58:05 EST 1998 | Mike McMonagle
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Mon Sep 10 13:44:43 EDT 2001 | Hussman
Hello All! I've been asked to change a current design using a shield. Currently we build it by using silver epoxy adhesive to make electrical connection. Just wondering if anyone out there has a experience with using surface mount clips that hold
