Electronics Forum | Wed Sep 26 11:42:19 EDT 2012 | comatose
I have an ap-25 and wish i had gotten the UP-2000 instead. How's that for an answer? The main difference is that the ap-25 uses linear motors and air bearings, whereas the up-2000 uses ball screws. The linear motors are faster, but the whole thing i
Electronics Forum | Thu Oct 04 10:54:11 EDT 2012 | eniac
I have only one incredible idea: this is example of different speed of heat transfer of neighboring pads. I saw it two times during last years, but on lead solder pastes (Sn63Pb37). The reason of this mistakes each times we found two: 1. errors duri
Electronics Forum | Sat Sep 29 19:04:13 EDT 2012 | e_music
Hello, I have just installed the demo version of GC-Powerplace. Could anyone here walk me through the process to generate pick and place file from gerbers? I don't have solderpaste layer. All I have got is signal layers (top/bottom), soldermask, sil
Electronics Forum | Mon Dec 03 16:05:55 EST 2012 | emeto
Hi all, We are going to evaluate new LEAD-FREE solder paste. We stopped our attention on 3 manufacturers but the variety of products is so big. What would you recommend for a daily basis use? Is SAC305 the most commonly used alloy? We are a subcontr
Electronics Forum | Wed Dec 05 13:19:23 EST 2012 | markcsi
We have an SMT-5000 that we have been using for many years, but up till now the smallest device was SOIC, SOT23 type devices. Now I have designed a board that has a 24 pin TQFN-EP device and a 10 pin LFCSP_W device. I am concerned that this is be
Electronics Forum | Wed Dec 12 09:46:32 EST 2012 | rway
You can go with smaller chip parts (0805 to 0603 or smaller). What size is D1? Can you go to a smaller package. Provide more details. You may not have the real estate to include the silksreen (i.e. reference designators). Consider omitting them.
Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
Electronics Forum | Wed Feb 27 11:20:15 EST 2013 | marcpeo
Sorry to hear of the difficulty with the rails on these systems. The 2 machines mentioned are 10 years old or more. The rails typcially last quite a while but replacement after 10 years is possible. Please feel free to e-mail me directly to discus
Electronics Forum | Tue Apr 23 09:49:18 EDT 2013 | rgduval
Thanks, Jeff. I ended up bringing someone in to help me with it. And, that's pretty much what we did. What a pain! Who ever designed these heads never expected them to fail, apparently! The actual head change out only took about a half hour (inc
Electronics Forum | Thu May 09 13:49:24 EDT 2013 | davef
First, it appears that your solder mask and your coating material appear to be incompatible. Second, IPA leaves a residue that's probably not compatible with your coating material, either. IPC-HDBK-830 - Guidelines for Design, Selection and Applic
