Electronics Forum | Fri Mar 04 17:19:31 EST 2005 | davef
Mrduckmann2000: Why do you want to do this? * Removing a non-washable / peelable temporary solder resist [TSR] is going become very tedious, because they do not release well from small / tight / isolated features. * Clay from washable resists will
Electronics Forum | Sun Mar 06 20:08:38 EST 2005 | mrduckmann2000
Davef, You have a good question. If we had perfect design engineers out there that would use the proper component spacing and not put SMT parts between and around thru-hole parts - glue and wave would work perfectly. I have done this with great su
Electronics Forum | Mon Mar 07 22:23:40 EST 2005 | mrduckmann2000
Ken, You nailed it! We have a Electrovert Vectra wave solder machine that will erupt solder all over the place while heating up, we had to disable the timer because of all the solder splatering. Electrovert told us that our machine had a small des
Electronics Forum | Fri Apr 01 10:27:58 EST 2005 | chunks
Wow, Daja Vu! Besides a 9 iron, there isn�t any official physical test you speak of. You can run a design of experiments to prove your joints are strong, but I wouldn�t suggest pushing, slapping or prying on a customers solder joints. Any such pok
Electronics Forum | Mon Apr 25 16:25:07 EDT 2005 | Mike Konrad
Hi Carl / Bill, I seem to miss your point regarding disclosure. As I CLEARLY stated, it is the perception of damage more than the possibility of damage. As a twenty year veteran of de-fluxing systems, I can assure you that there remains enough con
Electronics Forum | Tue Apr 26 16:00:08 EDT 2005 | jdumont
Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 ball BGAs. The pitch is .8 mils and the ball diameter
Electronics Forum | Thu May 05 09:50:29 EDT 2005 | patrickbruneel
Hi Hannu, You just gave a very realistic and practical view of the lead-free dilemma. The main reason that your coil coating doesn't get removed is because of the inability of lead free alloys to wet the surface and conduct the heat. Higher temperat
Electronics Forum | Wed May 11 16:13:49 EDT 2005 | keegomaster
Rob, - with free software upgrades included, how about hardware upgrades!? no prob paying for those? - "good part editor" do you have one you specially love/hate? - Bar corde reader is already considered, we're thinking on adding a DataMatrix reade
Electronics Forum | Thu May 12 11:02:48 EDT 2005 | deyo
I've looked at a lot of AOI's in the past couple years. First and formost KEEP IT SIMPLE! Second clamp the boards down this will aid in keeping the camera feild of veiw stable, most that I've looked at this was an option not a stock feature. Also sid
Electronics Forum | Sat Jun 18 08:03:58 EDT 2005 | davef
kenscj: Responding to your points of interest: * On the smoothness of BGA solder balls causing solder ball misalign, void, solder short after reflow: We expect the solder balls to be smooth and have no sharp irregularities. We can't recall attribut
