Electronics Forum | Thu May 28 09:23:59 EDT 1998 | Chrys
| Hello, | | I need some users information about "hot air knife" after the wave | bath: | - Defects reduction ? | - In what kind of boards(TH/SMT SOICS ect.) it is applied ? | - Where can I purchase it as a retrofit (Soltec Delta 6622cc) ? |
Electronics Forum | Thu Apr 02 11:41:26 EST 1998 | Scott Cook
| Hello, | We are currently trying to design and ultimately implement a system that will be able to count and manage component placement for three Sanyo chipshooters on three SMT lines. | As the number of components decreases in the reels we want to
Electronics Forum | Thu Mar 19 12:37:15 EST 1998 | Earl Moon
| | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | | 1. C
Electronics Forum | Thu Mar 05 13:17:19 EST 1998 | Justin Medernach
| Hello everyone! | Does any know anything about bare board size variations? | Is there a spec. or tolerance? | I'm running small lots of boards and during the screen printing process | I find that I cannot paste each board perfectly.I've tried other
Electronics Forum | Thu Feb 19 00:31:55 EST 1998 | Larry
The type of training I am looking for is things like micro BGA, flipchip, COB, new processes and techniques, ect. I already work with things like fine pitch QFP's, high mix double reflowed boards every day. I live in Vancouver, but I can drive to Sea
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Wed Dec 05 17:30:02 EST 2001 | davef
How do you know that "approx 450�C" is "too high"? As a side, the temperature on the temperature sensor is: * Inaccurate. * Not the temperature at the solder. Listen, operators are smart people. They have figured-out that they can solder faster wi
Electronics Forum | Tue Apr 29 14:13:52 EDT 2003 | stefwitt
My opinion to hold on to your machines was based on the current market situation. First of all, I don�t believe that a customer with ten boards will go to China for prototype production. Truth is, that the remaining market here is the prototyping mar
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
