Electronics Forum | Mon Oct 09 19:56:41 EDT 2000 | Dave F
CJ: Arturo and the others make good suggestions. Consider: IPC-7525 Stencil Design Guidelines
Electronics Forum | Fri Oct 06 10:52:16 EDT 2000 | Glenn Brash
We have officially launched our Sept 2000 Microelectronic Design program. Our students will be starting there internships in Sept 2001. We are now receiving applications for our May 2001 program. Should you be interested in offering internship or
Electronics Forum | Fri Sep 15 19:50:54 EDT 2000 | Murad Kurwa
Try IPC-SM-784 Guidelines for Chip-On-Board Technology Implementation (pg 16-17). Contact IPC or Document Center http://www.document-center.com/home for a copy. Goodluck Murad
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
Electronics Forum | Tue Aug 01 16:33:08 EDT 2000 | Ron Lasky
Jason, it looks like you have several options that have strong promise of working. I suggest you perform a designed experiment to find/optimize the best solution with these suggested approaches. Ron
Electronics Forum | Mon Jul 10 09:28:20 EDT 2000 | George English
I am looking to purchase an inexpensive gerber editing package. Does anyone have any ideas. It will be primarily used for the design of solder paste and adhesive stencils.
Electronics Forum | Mon Jun 19 08:23:23 EDT 2000 | JAX
Jacqueline, The following link will take you to a process related bga site.You might want to check out this bga design website also. www.analog.com/industry/dsp/bga/bgadesig.html Have fun, JAX
Electronics Forum | Wed Jun 14 19:47:58 EDT 2000 | Raeto Zryd
Hi All, I have an issue with our designers that there is a different size of pads needed for smt components (SOIC) and general whenn soldered with wave soldering equipment rather than with reflow gear. Anyone may point me to some reference material.
Electronics Forum | Mon Apr 02 17:20:33 EDT 2001 | kward
Try IPC-7095 at ipc.org. It is a complete reference on Design and Assembly Process Implementation for BGAs. Glenbrook Technologies was instrumental in the developemnt of this document
Electronics Forum | Sat May 27 11:13:27 EDT 2000 | Steve Thomas
Subject line pretty much says it all. We're going to try some stencil design changes to reduce midship solder balls. Anyone have some comments on pros or cons for either?