Electronics Forum | Thu Nov 30 10:01:52 EST 2006 | realchunks
It depends. If it's a current desing that can't be changed, we go outside the box on any issue to see if we can build it. Then it all comes down to time versus dollars. If it's a new product we offer suggestions to the customer and try to bang out
Electronics Forum | Wed May 08 04:20:58 EDT 2002 | S.E.J.E
Hi there. I intend to do some evaluation between different pastes, stencils, stencil apertures and reflow profiles (to find practical differences, evaluate stencil suppliers and have some desing guides among other things). I'm considering to use ben
Electronics Forum | Fri Jun 23 07:25:06 EDT 2006 | emeto
Thank you for the post cuculi. I really appreciate it. I've read about some kind of vectoral imaging machine technology. The explanation of the principal was: When you desing the component in the library, the machine takes this information(dimensi
Electronics Forum | Thu Nov 16 06:13:16 EST 2000 | Adam Seychell
I am currently building a home PCB etching tank based on the ammonia/ammonium sulfate chemistry. The etching system consists of a etching tank, and an electrolytic copper recovery tank. The result is a infinitely replenishable etching system without
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Wed Apr 28 16:49:47 EDT 1999 | Tony A
| | Anyone using hot air nife for wave soldering process. | | Does it work? | | Does it really eliminate solder bridging and does it create any other problems? | | | | any feed back will be much appriciated. | | | | Thanks | | | | Tony A | | |
Electronics Forum | Sun Dec 09 22:54:20 EST 2001 | dburr
It sound you have already discovered to root cause, flux entrapment in the via holes. Short of changing the desing, here are sone suggestions. The main thing is you have to dry out the via holes of the wet flux. Some things to try are: slow down t
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
Electronics Forum | Thu Apr 29 17:18:29 EDT 1999 | JohnW
| | | Anyone using hot air nife for wave soldering process. | | | Does it work? | | | Does it really eliminate solder bridging and does it create any other problems? | | | | | | any feed back will be much appriciated. | | | | | | Thanks | | | |
Electronics Forum | Fri Jun 14 09:15:02 EDT 2002 | edahi
DaveF, Yeah you got that right...because the initial stages of the project, the products would only attach 1 passive (capacitor) hell when things got too cheesy they wanted to attach 20 caps or so....this is not like board assembly, this only 1 Flip
