Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Fri Jan 02 09:39:30 EST 2009 | angiewest
Adam, Our X-ray requirements are due to state requirements (WV 64CSR23) has a list 'Subjects for Instruction of Radiographer Trainees'the main headers are A. Fundamentals of Radiation Safety B. Radiation Detection Instrumentation to be Used C. The Re
Electronics Forum | Tue Mar 31 12:43:52 EDT 2009 | dallascap
I don't think there is anything releated to IR light in your false calls rate rise on Post-reflow. Soldering Flux is most probably the reason. Indeed, more or less soldering flux residue condenses on the boards according to the oven extraction syst
Electronics Forum | Thu Apr 09 15:39:08 EDT 2009 | dilogic
USOS software has ability to detect bad marks on the PCB. Just select an arbitrary area clear of components and apply a sticker to that place. The size of the sticker is not important, as you can define the search area. In the Product Editor, go to c
Electronics Forum | Sat Apr 25 02:46:18 EDT 2009 | smellew
FYI SME offers a replacement Tape leaf detection system which covers the whole range of FUJI CP4-CP7 machines.its also very reasonably priced. It doesn't use Fibre Sensors or mirrors. it only has 1 adjustment which is height via Eccentric screw. even
Electronics Forum | Thu May 07 19:29:40 EDT 2009 | kareal
Hi Davef, Do you means it is natural for tin diffusion to copper trace during SMT process? but I could not detect tin in UHAST T=0 unit, and the tin diffusion was found only in copper trace of C4 cage. Two question: 1) Could you tell me which pr
Electronics Forum | Thu Dec 17 13:28:31 EST 2009 | fönsi
Hi Pete Thank you for your feedback. A few weeks ago, I tested the Demo-Version of GC Powerplace but I was a bit disappointed about the results. For big Boards, I was still a long time busy assingning the designators to the pads. I search a simple to
Electronics Forum | Wed Mar 24 11:25:47 EDT 2010 | rajeshwara
I recommanded AOI inspection as I am a AOI programmer too. 1.Yes u have to write programm for every PCB design,but u maintain the standard library. 2.If u have standard library and SMT machine CAD file ,then it doesnt take more than 30 mins. 3.No I
Electronics Forum | Fri Apr 02 14:11:21 EDT 2010 | bigdaddysoy9
Manjunath, I prefer orthogonal systems. In my experience they are actually better at detecting coplanarity and HIP defects than multi camera systems. They are obviously limited, in that they can not inspect a component under another component, b
Electronics Forum | Fri Apr 16 11:36:33 EDT 2010 | fönsi
Thank you for the links. I didn't know that there are companys that build test systems for ultrasonic inspection. My idea was to use a ultrasonic detector similar to crack inspection, for example to detect if the cooling pad is melted, or a solder jo