Electronics Forum: determine pitch (Page 1 of 13)

Less solder with fine pitch qfp

Electronics Forum | Tue Sep 30 14:06:04 EDT 2008 | realchunks

What pitch? You can go 5 mil or even 6 mil stencils depending on your screen printer. Also what do you consider "less solder"? What defect are you having. Remember on a QFP you use the heel filet to determine proper solder joint - not the toe.

Re: fine pitch on thick copper

Electronics Forum | Mon Dec 20 12:50:27 EST 1999 | Wolfgang Busko

Hi Pascal, 0,65mm pitch normally isn�t much of a problem. With 90�m CU I don�t have any experience but would like to know what deviation from nominal value for the pads you get with different PCB-deliveries. In short, for the standard Cu=35�m we se

Re: Temp Profile for 0.05 pitch

Electronics Forum | Mon Mar 02 09:45:08 EST 1998 | Justin Medernach

Can anyone advise a good starting point for a temp profile for on 0.05" and 1206 component boards? These boards are simple by todays standards and do not contain any fine pitch or other special components. Thanks in advance... MM Mike,

Re: Temp Profile for 0.05 pitch

Electronics Forum | Mon Mar 02 23:08:50 EST 1998 | Scott McKee

Can anyone advise a good starting point for a temp profile for on 0.05" and 1206 component boards? These boards are simple by todays standards and do not contain any fine pitch or other special components. Thanks in advance...

A.O.I - no salesman pitch pls

Electronics Forum | Wed Jul 16 18:08:11 EDT 2003 | mgershenson

OK, disclaimer; I'm a salesguy, but I was a process engineer for quite a lot longer than I've been in sales. Your question is very vague, and may be difficult to answer. There are many ways to configure AOI to inspect solder, but as has been pointed

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

Testing potential employees.

Electronics Forum | Tue Feb 24 08:57:28 EST 2004 | VE

From my experience, stencil thickness should be determined by your minimum component lead pitch and squeegee pressure will be determine by the type of squeegees you are using. Best method of checking whether or not your screen printer is set up and

Re: flip-chip/ more detail

Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach

What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX

Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX

Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar

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