Electronics Forum: dewetting intermetallic (Page 1 of 1)

Zn/Pb Diffusion

Electronics Forum | Fri Apr 19 15:48:28 EDT 2002 | davef

I don�t know much about zinc either. I can tell you that zinc forms no intermetallics with lead. So, I�m not so sure that �diffusion� is the correct term. Of the following: * Hwang "Modern Solder Technology For � * Wassink "Soldering In Electronic

No-Lead solder defect - No solder on pads

Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean

I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio

Terminal solderability + Silver plating

Electronics Forum | Tue Aug 10 06:29:49 EDT 2004 | Nippy

Hello, I am in need of some assistance with a problem we are having with soldering some terminals... Basicaly I need to solder thin tabs onto a round metal post (hole through tab) We have been seeing poor quality joints, de-wetting and what looks l

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

Terminal plating

Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef

Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl

Solder balls on pads - lead free

Electronics Forum | Wed Sep 19 10:27:03 EDT 2012 | davef

My email mail machine couldn't send this to you ... Hi Stivais ... I didn't read the report. It seems to require downloading of a 'reader' of some sort. No thanks. If you would, just attach the report to this email. Regardless, energy-dispersive X-r

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian

| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 14:37:00 EDT 1999 | Earl Moon

| | | | | | | | | Dave, I'll respond by paragraph: | | | | | | | | | Brian: | | | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like

lead free platings and tin lead

Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef

NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa

Re: PCB fab supplier supplier/evaluation

Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon

| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo

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