Electronics Forum | Thu Sep 09 14:19:33 EDT 1999 | Doug Philbrick
| | We are currently quoting several vendors on the through hole portion of a new mixed technology production line. Unfortunately, I have not been able to find much information about NEA's cabaility, quality, or service. Any comments or references
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Tue Aug 31 13:54:50 EDT 1999 | David Spilker
Do any SMTneters out there have a good solution to substitute SMT parts that you are willing to share? I presume all of us have the issue where purchasing wants to buy "the same part" from a different vendor. While the part may be the same electrical
Electronics Forum | Wed Aug 18 12:35:41 EDT 1999 | Earl Moon
| | WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE
Electronics Forum | Sat Jul 17 17:42:02 EDT 1999 | Alain
| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initiall
Electronics Forum | Sat Jul 17 17:42:03 EDT 1999 | Alain
| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initiall
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
Electronics Forum | Thu Apr 15 08:21:47 EDT 1999 | Terry Keen
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Thu Apr 15 09:45:34 EDT 1999 | Terry Keen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Tue Apr 13 09:50:18 EDT 1999 | Dave F
| Hello. | | I'm now investigating the current technological issues | on surface mount devices. | For example, I want to know the limitation of | the surface mount machine. | | Where can I get the materials for this purpose? | | Thank you | Cho
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