Electronics Forum | Fri Dec 15 08:44:17 EST 2000 | DaveJ
I need some advise from the reflow experts. In your experience in nitrogen versus air reflow, what would be the differences in profile parameters? For example, if I profiled a board in nitrogen and achieved (for a particular component) ramps rates un
Electronics Forum | Fri Dec 15 11:21:45 EST 2000 | ralph
In my experiance, I have seen no difference in profiles between nitrogen and air reflows. What I understand is that the Nitrogen blanket allows for a greater solderability to gold plated pads. I also found that when dealing with fine pitch componen
Electronics Forum | Fri Dec 15 15:59:35 EST 2000 | Hussman
Dave, It will all be about the same - changing atmospheres does not affect your heater output. You may experience some differences in the way your solder joints look (a little duller), but with some of the newer pastes out there, you can overcome i
Electronics Forum | Fri Dec 01 15:37:50 EST 2000 | Dason C
Jim, you may need to look with different paste instead of the cleaning solvent. Please advise what is the paste which you currently using? Beside, when you talking about the board stayed in hot area, is it a drying area or the cleaning zone. If it
Electronics Forum | Mon Nov 06 21:02:30 EST 2000 | Dave F
I love this!!! Two whizzettes with the same information and they spin-off in two different directions. Gad this is great!!! Delamination is a pretty broad topic, but that you have a problem with two suppliers makes me think the delamination is cau
Electronics Forum | Thu Nov 02 03:42:49 EST 2000 | CHRIS MAY
Tombstoning primarily occurs due to the fact that the paste may melt and wet the metallized face of the chip earlier or better at one end than the other. This could be due to a difference in heat capacity (thermal shadowing ?) or that one end of your
Electronics Forum | Thu Oct 26 12:40:49 EDT 2000 | NLykus
Antonio, I would need to have more profile information i.e. preheat temp (hold time) as well as soaking zone (time). What is the peak temperature and how long is it held there. Also, one more thing to check, because I have seen it in the past, is
Electronics Forum | Tue Oct 17 13:37:54 EDT 2000 | dpoling
We have this same model and are very disappointed with it. It has several issues that we do not like: 1. The solder feeder has never worked properly. 2. The fingers are very soft material and bend easily. 3. There is no way within the machine to adj
Electronics Forum | Wed Oct 04 14:46:46 EDT 2000 | Kal. Chak.
Hi folks, What are the differences between Epoxy resin(ER)conformal coating and adhesive stacking/bonding material? My PSA/PRA (Post solder/reflow assembly)bracket assembly process got some ER adhesive encroachment on pads/solderjoints. I have chec
Electronics Forum | Fri Sep 15 08:00:49 EDT 2000 | Mark Charlton
I've been using the Philips CSM84V for more than 7 years now and would be glad to help you any way I can. Do you have a Mark III or is you machine a Mark II or earlier? Some important differences in the way things are done between the two. CSM Too
