Electronics Forum: differ (Page 261 of 579)

Expired Loctite

Electronics Forum | Mon Dec 02 13:55:49 EST 2002 | stepheno

Where I worked we used a different chip bonder. When we had trouble with flux entrapment in the epoxy from the wave solder, we checked the date of the epoxy. The tube didn't have one but the manufacturer gave a shelf life of 6 months and then the s

Solder Sphere/pad size plotted vs. pitch design?

Electronics Forum | Mon Dec 09 21:15:27 EST 2002 | MA/NY DDave

Hi I haven't looked yet at what DaveF gave you. It is my guess that your SJR stands for Solder Joint Reliability. The answer would in general be NO to your question. Usually things in the design community are done in steps that provide a certain

component availability management

Electronics Forum | Sat Dec 14 18:40:29 EST 2002 | arzu

we are using aegis circuitca for manufacturing preparation. It works fine. we are a prototype center with small series of different cutomers.Our problem: keeping control over all components... Some are standard in house (used by other depertments as

Fine pitch paste release problems.

Electronics Forum | Fri Dec 20 11:32:51 EST 2002 | D. Adams

Check your stencil apertures making sure they are trapazoidal and smooth. I have hadjobs where the laser stencil was improperly cut (poor laser settings leaving a rough hole even after electropolish. Be sure to specify a .0005 trapazoid in your ste

Accidental solder mask

Electronics Forum | Wed Dec 18 09:04:29 EST 2002 | russ

Dave, You stated that an unfilled via is of greater strength than a filled or partially filled via. I posted to another thread recently and I stated that a filled via was of greater strength than an unfilled. I was tought (incorrectly?) that a fill

Solder short-BGA with thermal pad

Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto

If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal

LPMTF and EMTF

Electronics Forum | Fri Jan 17 16:42:47 EST 2003 | MA/NY DDave

Gee this was a fun tread. I guess you mean Univeral Instrument Corporation's products. I would give them a call since they have a training center in Binghamton, NY and may have what you need. Trust me, They need the business and should jump all ov

silver pads, reflow charateristics??

Electronics Forum | Wed Jan 15 11:42:57 EST 2003 | burb1999

we have recently been trying silver composition on our pads with our PCB boards. I am wondering what if any characteristics are different from tin etc... I have found with profiling the board it to be about the same temps. but getting granular looki

Quad

Electronics Forum | Fri Jan 24 19:49:40 EST 2003 | jonfox

QSA series was a joint project, but Quad machines still use feeders made by Samsung, or Samsung makes the feeders Quad designed (whatever). QSoft has two different evolutions, Qsoft(1) went to Samsung, and Qsoft(2) stayed with Quad. I'm sure they h

BGA PCB Pad size

Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty

Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself


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