Electronics Forum | Wed Aug 17 10:46:48 EDT 2005 | pjc
MPM did not discontinue the camera, the camera manufacturer did. It�s not a custom made camera for MPM. Try searching used or second-source cameras. There are three types of vision systems offered on the SPM: manual cross-hair, semi-auto and high-res
Electronics Forum | Mon Aug 22 09:27:20 EDT 2005 | javi
The list is not yet completed but I picked few different component that our supplier are not able to get in Lead-Free or problem to get leadtime: Mfg Part : Zener Diodes BZG03 - MFG : Phillips Mfg Part : PME271Y447M - MFG: Evox-Rifa Mfg Part : LMC606
Electronics Forum | Sun Aug 28 22:19:34 EDT 2005 | sonata06
Origin: China Price: To Talk About Specification: 1)Thickness Of Silver Plating:From 2Um-15Um 2)Material:ABS or PBT 3)Cu-Ni-Silver 4)Earth Module,Profile Module,Profile Switching Module,Disconnection Module,Connection Module 5)Different Colors are
Electronics Forum | Thu Sep 01 14:24:44 EDT 2005 | lsmith
I do not have a ERSA Versaflow but do have some ERSA equipment. Only can tell you I will most likely not purchase anything else from them. The experience I have with their service after the sale would have to be rated VERY low. In addition, they emai
Electronics Forum | Tue Aug 30 07:01:52 EDT 2005 | edgetech
EdgeTech SMT Tech here. I was questioning the process our Engineers are using concerning Water Soluble solder paste. I have no experience with this paste. I was wondering what need so be done differently when using this paste. As far as I know the on
Electronics Forum | Wed Sep 28 20:54:04 EDT 2005 | Ken
I would run scale calibration first (for the suspect camera). That may be your only problem. However, if your having a rotation issue and all major angles are off (differently) then it is most likely R-axis accuracy. However, I would run AMF and
Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC
The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th
Electronics Forum | Mon Oct 10 08:53:54 EDT 2005 | rsmith@z-mar.com
The most important thing you can do is to maintain the same electrical potential between the ESD-S product, the operator and the worksurface. This is typically achieved through a grounded dissipative worksurface and an operator grounded via a wrist s
Electronics Forum | Fri Oct 14 09:21:36 EDT 2005 | lupo
According with temperature vs. wetting force diagram 245-250C/degrees is better, so lower temperature than 500F means better solder fill. If the speed is too lower the solder suck out form the hole. Usually 120-150cm/min. is good. (2-4s contact
Electronics Forum | Fri Oct 14 17:54:15 EDT 2005 | Mika
Thanks Patrick for the replay, No, we do not mix the alloys nor Pb pcb:s/RoHS pcb:s in the case I described. It is simply as this: With both the different soldering processes we facing this phenomenon; but whith the RoHS SN100 or SAC305 it turns out
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