Electronics Forum | Thu Nov 19 16:24:23 EST 1998 | Earl Moon
| Hello Everybody | | I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more info
Electronics Forum | Thu Jan 08 16:43:43 EST 2004 | Dean
Unless your machine (internal) thermocouples are each calibrated and compensated no two machines will deliver eactly the same results. Here are your challenges: 1. Data acquisition equipment A-D converter errors 2. PCB measurement thermocouple (t
Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef
It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h
Electronics Forum | Wed Aug 24 10:07:56 EDT 2005 | stepheniii
I think where the fuzzy thinking starts is by calling the recipe's; profiles. Or maybe I"m being too fussy. Idealy you want every solder joint to have the same thermal "profile" (not recipe). That is the temperature over time is best if identical fo
Electronics Forum | Fri Jun 17 16:15:41 EDT 2011 | rway
One problem you may have with deeper scoring is not so much broads breaking apart unintentionally, but warping upstream while on the SMT line which can cause sagging. This may give you transport issues from one machine to another, and if you have an
Electronics Forum | Wed Feb 05 08:51:13 EST 2014 | emeto
What I think it does is to calibrate the camera. You have your tube on the bottom and your camera on the top. For my machine(Dage) I have to put the board I am going to examine inside and select a point on the board surface. THen I just click on this
Electronics Forum | Thu Sep 23 08:47:25 EDT 2021 | majdi4
1)Though in many cases the difference between SAC305 and SAC405 was small,and not always statistically significant, it was observed that SAC405 generally outperformed SAC305 joints. Under 0°C to 100°C thermal cycling,no statistically significant
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Tue Dec 12 15:22:50 EST 2000 | Michael Parker
Dave - the most significant difference between the two titles (that I have experienced) is the location of assignment. Usually MFG. Eng.'s are responsible to a fixed set of equipment and are more concerned with how the product acts within the machine
Electronics Forum | Tue Aug 08 20:43:41 EDT 2000 | Dave F
Tom: So is warp or is it twist? They�re different problems, possibly with different sources!!! And possibly different solutions!!! Consultants to talk to are: Earl Moon (pod@vcn.com), Werner Engelmeyer (engelmaier@aol.com), Les Hymes (les.hymes@w
