Electronics Forum: differs (Page 356 of 578)

Re: Hot Bar Mfg.

Electronics Forum | Wed Jun 16 14:05:23 EDT 1999 | Dave F

| A potential customer of our is inquiring if we have capability | for Hot Bar manufacturing in the PCBA manufacturing world. If someone can explain to me what this entails, I would greatly appreciate it. Thank you. | Gary: Tell your customer NO

Re: Criterion of PCBA bending degree

Electronics Forum | Thu Jun 10 14:52:55 EDT 1999 | Earl Moon

| Hello all! | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's the pr

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien

| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca

Re: Shear Testing

Electronics Forum | Mon Jun 07 11:21:38 EDT 1999 | Brian Wycoff

| | I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test m

Setting up solder material evaluation (suggestions?)

Electronics Forum | Mon May 03 17:23:24 EDT 1999 | Kelly Morris

I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I will b

Using solder paste in rework

Electronics Forum | Sun Apr 25 10:28:46 EDT 1999 | Joe Cameron

Hello all, Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not filled

Re: PLCC's on IP3

Electronics Forum | Thu Apr 22 09:09:10 EDT 1999 | Scotty

| Recently, we have been having problems with PLCC's passing vision on our IP's If the part is set up to be placed on Head 2, it will not always pass vision. However, if we move it over to Head 1, it will pass and place just fine. Now, I do realiz

Re: feeder width

Electronics Forum | Tue Mar 30 11:39:59 EST 1999 | Stefan Witte

| Hello, | | I'm a student assistant in a research project that deals with the simulation of PCB assembly systems. At the moment I collect information about SMDs. | My problem is how to assign the correct feeder width to various devices in a simulat

Re: For all Siemens Siplace users

Electronics Forum | Thu Mar 25 16:59:20 EST 1999 | RAG

| maybe someone can help me with this | problem I have 4 S-20 machines on 3 | lines and I notice that when I omit | a component on the station computer | other components are not assembled | and on each PCB it's different | components and not the s

Re: For all Siemens Siplace users

Electronics Forum | Fri Apr 09 10:53:54 EDT 1999 | RNLM

| | maybe someone can help me with this | | problem I have 4 S-20 machines on 3 | | lines and I notice that when I omit | | a component on the station computer | | other components are not assembled | | and on each PCB it's different | | components


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