Electronics Forum: differs (Page 386 of 579)

how clean is clean?

Electronics Forum | Fri May 27 17:21:35 EDT 2005 | mrclean

Dear SM Rookies, Another acceptable test method is visual inspection. IPC-A-610 details what to look for with different contaminants, providing magnified pictures of the possible visual residues. With an existing cleaning process, magnification

New SMT line - P&P equipment selection help

Electronics Forum | Fri Jun 03 10:44:26 EDT 2005 | ve7khz

Hi Grant, Rob et al. Thanks again for the thoughts and ideas. Yes, service is definately important and we are getting excellent service from our Panasonic and Amistar reps. We are in Canada and only run 5 days/week, 8 hour shifts, 150 different prod

Frequency to verify the reflow profile

Electronics Forum | Fri Jun 03 09:00:06 EDT 2005 | russ

How many times have you found that your oven was performing differently? this will give you the answer on frequency. We have a dedicated board and profile that we use to verify the oven operation. We perform this every 3 mos. and I believe that th

BGA pad size

Electronics Forum | Tue Jun 14 08:37:18 EDT 2005 | jdumont

Morning all, just took a look at a new board we just got in and the there are different pad areas under the same BGA. What happened is engineering uses wider trace sizes for some pads and those overlap when more than one go to the same pad. This caus

BGA pad size

Electronics Forum | Thu Jun 16 18:16:32 EDT 2005 | davef

Josh: You're correct it's tough to describe the layout of the BGA pads and traces. We wouldn't be too excited about seeing this board either. On one hand, for the obvious lack of care taken in doing the layout, this is a junk board and you shouldn

Poor reflow over gold plating

Electronics Forum | Tue Jun 28 18:20:49 EDT 2005 | russ

Matt, have you run a profile on this board? Just because it's .062" doesn't mean that any old .062" profile will work. We have .062" thick boards that almost nil for copper and other are utilizing 2 oz. layers internally. They require quite diffe

Tombstone caused by flux residue

Electronics Forum | Thu Jul 07 04:34:19 EDT 2005 | Lloyd

This problem exists at a very low level but happens on all our discrete components, all our products and in two plants. Between the PCB land and the component termination there is a barrier of flux residue, this actually lifts the component slightly

PROBLEM IN ONE COMPONENT (0603)

Electronics Forum | Sat Jul 16 08:12:44 EDT 2005 | davef

skandaae: By "tilt" do you mean that one end of the 0603 has lifted from the board surface? If so, we call this "tombstone". In general, tombstoning is caused by an imbalance in temperature or forces on the component. * Convince yourself about the

soldering irons for lead free

Electronics Forum | Tue Jul 12 09:51:42 EDT 2005 | russ

We use the JBC irons with and without the "leadfree" tips. We really have not noticed much difference between the standard and the lead free. The lead free tips do last a little longer but the tips are somewhat deformed by the extra plating. As f

smt production

Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn

Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top


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