Electronics Forum: differs (Page 456 of 578)

Re: coating with no-clean?

Electronics Forum | Thu Jan 13 15:19:51 EST 2000 | Dave F

Hey Jack: It's certainly "do-able." Conformal coating adhesion testing was done as part of the "Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low Residue Soldering Task Force," published by Sandia Na

Re: BGA reflow profile

Electronics Forum | Tue Dec 28 12:55:16 EST 1999 | Justin Medernach

Greg, The best advice that I can give you is a PBGA will respond just like any other surface mount package. There may be a 5 degree delta between a PBGA 356 and a QFP208 but the two respond very similarly in the convection reflow environment. CBGAs

Re: Screen Printer Visual Inspection Equipment

Electronics Forum | Fri Dec 17 16:25:05 EST 1999 | Brian W.

I used an off-line paste height measurement device to control my paste process. I did not inspect every board, just a random sample once an hour. I have used both manual and automatic devices. I like the automatic becuase: 1 - I have no "operat

Re: Laser Marking using 2D Matrix Code

Electronics Forum | Fri Dec 17 09:47:10 EST 1999 | John O'Brien

Chuck: Your best resource is the Symbology Research Center in Huntsville AL. In is a research and development facility run by RVSI Acuity CiMatrix, the folks who invented the Data matrix (DM) 2-D code. This facility is unbiased as to technologies and

Re: Solder Wetting

Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup

Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 01:05:09 EST 1999 | cklau

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? Ans: Fur inner layers Min = .006" hole-pad annular ring ; inner pad dia - hole dia/2 For outer layers Min = .005" hole-pad annular ring ; outer p

Re: Test the solder point

Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F

Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.

Re: Solder Paste Dispensing for BGA repair

Electronics Forum | Fri Nov 26 06:18:18 EST 1999 | stefano bolleri

Jeff & Ted, we have used a dispensing system too and yes, I agree, we are not too happy with the results. Not at the point that it doesn't work, though. I think our problem basicly is that we have selected an entry-level dipensing system. We are app

Re: AOI

Electronics Forum | Mon Nov 22 11:16:04 EST 1999 | Boca

Chris, Some ramblings- Your choice depends on factors like which defects you're looking for, bugdet, quality inspection philosophy, high or low mix environment, sample sizes or 100%, and so on. Are you going to test 100% of the product coming off t

Re: paste release from stencil - recommendations

Electronics Forum | Fri Nov 19 22:48:26 EST 1999 | mark

Steve, your comments from your stencil vendor are very interesting. Any decent laser cutter automatically cuts a trapezoidal aperture. This is just the nature of the cutting. We have a bunch of lasers (and chem-etch). You have to polish your laser cu


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