Electronics Forum | Sat Mar 21 09:09:40 EDT 2009 | davef
Your puzzlement about blowholes in PTH solder connections during reflow soldering comes from: * Boards are hydroscopic. So, moisture content of the board is uniform. * Gold plating is uniform. * Nickle plating is uniform. * Copper plating on your PTH
Electronics Forum | Fri May 01 00:27:12 EDT 2009 | rodrigo
Hi all, We had a servo amp replaced (SA-6) and the machine worked with no problem for the first panel (this panel of 10 only needs a TQFP100 from the MTU). Then I got the "Servo NG" error again. One of the servo paks showed a "7" on the LED. The err
Electronics Forum | Wed May 13 03:22:26 EDT 2009 | J.Hall
We use SAC387 (or 96SC) and I found that the SelectX was only marginally effective and that other factors (varying the wave height mainly - we use pallets) affected bridging more. Also, because we run different products at the same time through the
Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Tue Jul 14 07:37:31 EDT 2009 | tony_d
Hello Reese, We currently own two MIRTEC MV-3 desktop machines and one MV-7 inline machine (so you can tell right away that I am a little biased.) We had an opportunity to evaluate both the YESTech and MIRTEC machines on our production floor. The
Electronics Forum | Sun Jul 26 06:31:07 EDT 2009 | hohk
Hi everyone, I need to connect a cylindrical disc device (piezo ceramic sensor) to the PCB trace without using high temp solder. I plan to use "3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719" to connect the device to the PCB trace
Electronics Forum | Thu Aug 20 13:59:42 EDT 2009 | dcell_1t
Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are: Placement force: regular placement vs "force applied" to dip the component on th
Electronics Forum | Thu Aug 27 23:51:10 EDT 2009 | leadthree
I have a little problem. We are assembly subcontractor and we purchase most parts ourselves. Currently we have all BOM/Partlists in an Excel format. We get a few RFQ each month, prices come from well known original sources, Mouser, Digikey etc. and
Electronics Forum | Sat Feb 27 20:02:06 EST 2010 | jmelson
Yup, that seems to be the procedure in the manual. But, it gets complicated, as the head has a rotation, the part has a rotation, and the MA station has a rotation, and it gets pretty confusing to figure out which way to tweak the offset values for
Electronics Forum | Thu Feb 18 14:42:38 EST 2010 | djsmith1000
Hi everyone, First post here. I am completely new to smt as well. We are a small startup and would like improve our in-house smt assembly capability from manual assembly. We are looking at small production runs, initially about a total of 200 board
