Electronics Forum: differs (Page 521 of 578)

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Mon May 10 08:00:14 EDT 1999 | Timothy O'Neill

| | | | I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so

Re: Successful Transfers to Contract Manufacturers

Electronics Forum | Tue Apr 27 17:34:52 EDT 1999 | Jeff Sanchez

| | As I transfer prototypes/pilots out of my shop (because the designs are mature or Engineering confidence is high). How do I minimize my risk and ensure success for both the CEM and my boards. | | | | Best Regardsgroup. This would include low t

Re: Successful Transfers to Contract Manufacturers

Electronics Forum | Wed Apr 28 07:35:54 EDT 1999 | Corey Peterson

| | | As I transfer prototypes/pilots out of my shop (because the designs are mature or Engineering confidence is high). How do I minimize my risk and ensure success for both the CEM and my boards. | | | | | | Best Regardsgroup. This would include

Re: Adhesion loss on passives over wave

Electronics Forum | Mon Mar 22 18:03:15 EST 1999 | Marc

| | | | | Hi folks, | | | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diamet

Re: Solder Resist Solder balls

Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon

| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,

Re: no-clean process / Got Dendritus Eh?

Electronics Forum | Sat Sep 26 19:09:17 EDT 1998 | Graham Naisbitt

As an addendum to Daves posting, please consider that: There is no such thing as no residue fluxing. A no-clean must herefore, have benign residues - in other words, they are not as efficient at removing surface oxides to enable good solder joints. S

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Thu May 28 07:25:58 EDT 1998 | Earl Moon

| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Thu May 28 05:43:33 EDT 1998 | Earl Moon

| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p

Re: Bottom side bridging

Electronics Forum | Wed Apr 15 15:04:18 EDT 1998 | D. Lange

| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble

Re: Bottom side bridging

Electronics Forum | Wed Apr 15 14:57:20 EDT 1998 | D. Lange

| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble


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