Electronics Forum: differs (Page 66 of 578)

Re: BGA Rework

Electronics Forum | Fri Dec 19 11:52:03 EST 1997 | Gary Miller

We can offer you several different ways. give us a call and we can help. (510) 455-8602

Assembly Types

Electronics Forum | Mon Dec 08 19:44:20 EST 1997 | Richard

Hello, I am just getting into the SM world. I am finding conflicting information on the different types of assembly. I was originally understanding that Type I was pure SM, Type II was a mix of SM and TH, with variations, and Type III was pure TH. Is

Rectangular uBGAs with 1 raised edge after reflow

Electronics Forum | Tue Aug 07 20:53:14 EDT 2001 | davef

slowing-down the conveyor to allow the solder to heat these balls more. But that may not be the answer, because if the flux is exhausted, more heat will not help. Then if the flux is exhausted, the answer is to crank the belt. Two different answer

SMT Classes

Electronics Forum | Thu Aug 30 12:21:13 EDT 2001 | monkey

Send them to the SMTA - they have classes and courses for all levels. There is one in Boston at the end of next month. They have one at a different location every 3 or 4 months... http://www.smta.org/smtai/index.cfm

aoi inline

Electronics Forum | Tue Aug 21 21:11:29 EDT 2001 | davef

It depends on what you're doing. Say for component placement verification, a line that's kicking-butt might have time to look at a somewhat different quarter of each board, depending on lots of stuff [eg, board, AOI equipment, line rate, etc.]

Pad and Stencil Design

Electronics Forum | Mon Sep 17 17:49:02 EDT 2001 | arzu

What about the material of the stencil? Nickel formed? stainless steel? even more materials are available, some with different ways to form the apetertures.

reflow profile

Electronics Forum | Fri Sep 21 21:43:16 EDT 2001 | dougk

We're used to placing the theromcouple on the solder joint and securing it with thermally-conductive UV adhesive. It's quick & easy to apply, and I've only seen a couple degrees difference from high-temp solder technique. Thoughts?

Component Text (Fonts)

Electronics Forum | Tue Oct 02 20:47:30 EDT 2001 | davef

There is no standard that describes component part marking requirements. Component fabricators take different approaches to marking. The major marking methods are: * Laser * Epoxy * No marking Maybe with this as a starting point, we can discuss yo

Teflon PCBs

Electronics Forum | Mon Oct 08 17:01:19 EDT 2001 | upinder

Hi All. Need some immidiate help. I need to know any / all basic info regarding Teflon PCBs. Any special requirements for assembly on SMT and thru-hole lines, like profiles, placemnt , wave etc. Will there be some basic / big differences in comparis

Teflon PCBs

Electronics Forum | Mon Oct 08 20:50:37 EDT 2001 | ksfacinelli

What material are you using? There are a great deal of different Teflons (in the family of Teflons) material....is it from Gore or Rodgers???? Does it have aluminum backing?? More information necessary, Kevin


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