Electronics Forum: dipping and profile (Page 1 of 29)

BGA flux dipping process

Electronics Forum | Tue Jun 02 21:13:08 EDT 2009 | kircchoffs

thanks for the inputs. we are planning to run on fuji nxt i think cycle time will not be an issue. i still have another question if we can still use the same reflow profile for paste? or do we need to create another profile?

BGA flux dipping process

Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe

We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian

We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef

First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so

Intermetallics and reflow profile

Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe

I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow

Re: Intermetallics and reflow profile

Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F

MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a

Can anyone recommend a reflow profile for already flowed solder?

Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm

As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

Mydata Pick and place

Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt

I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on

CSP and BGA soldering difference.

Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip

"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on

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